BLM18KG471SN1D Murata, BLM18KG471SN1D Datasheet - Page 143
BLM18KG471SN1D
Manufacturer Part Number
BLM18KG471SN1D
Description
EMI/RFI Suppressors & Ferrites 0603 470ohms 1.5A
Manufacturer
Murata
Datasheet
1.BLM18EG121SN1-D.pdf
(209 pages)
Specifications of BLM18KG471SN1D
Product
Chip Ferrite Beads
Impedance
470 Ohms
Maximum Dc Current
1500 mAmps
Maximum Dc Resistance
0.13 Ohms
Operating Temperature Range
- 55 C to + 125 C
Package / Case
0603 (1608 metric)
Termination Style
SMD/SMT
Dc Resistance Max
0.13ohm
Dc Current Rating
1.5A
Ferrite Mounting
SMD
Ferrite Case Style
0603 / 1608
External Width
1.6mm
Operating Temperature Max
125°C
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BLM18KG471SN1D
Manufacturer:
Murata Electronics North Ameri
Quantity:
36 803
Part Number:
BLM18KG471SN1D
Manufacturer:
MURATA/村田
Quantity:
20 000
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NFp Chip EMIFILr
!Note
2. Solder Paste Printing and Adhesive Application
NFM
NFR
NFL
When reflow soldering the chip EMI suppression filter, the
printing must be conducted in accordance with the
following cream solder printing conditions.
If too much solder is applied, the chip will be prone to
damage by mechanical and thermal stress from the PCB
and may crack.
Standard land dimensions should be used for resist and
copper foil patterns.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
Series
NFM18C/18PC
NFL18ST
NFM3DC/3DP
NFM41C/41P
NFM18PS
oGuideline of solder paste thickness:
0.05
Soldering and Mounting
100-150 m: NFM18/21/3D/31P, NFR, NFL
150-200 m: NFM55P
100-200 m: NFM41
1.0
2.2
0.4
1.0
2.5
3.9
1.5
3.5
5.5
0.8
1.2
2.0
Solder Paste Printing
NFL18SP
NFM21C/21PC
NFR21G/NFL21S
NFM31P
NFM55P
1.0
2.0
1.5
4.7
6.7
0.4
1.4
0.6
2.6
4.4
1.0
2.5
When flow soldering the EMI suppression filter, apply the
adhesive in accordance with the following conditions.
If too much adhesive is applied, then it may overflow into
the land or termination areas and yield poor solderability.
In contrast, if insufficient adhesive is applied, or if the
adhesive is not sufficiently hardened, then the chip may
become detached during flow soldering process.
NFM3D/31P/41 Series
Apply 0.1mg for NFM41C/41 and 0.06mg for
NFM3D/NFM31P of bonding agent at each chip.
Do not cover electrodes.
Bonding agent
Adhesive Application
Continued on the following page.
Coating position of
bonding agent
(in mm)
141
Mar.28,2011
C31E.pdf
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