BLM21BB151SH1D Murata, BLM21BB151SH1D Datasheet - Page 82
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BLM21BB151SH1D
Manufacturer Part Number
BLM21BB151SH1D
Description
EMI/RFI Suppressors & Ferrites 0805 150ohms HiSpeed Signal Line Tape
Manufacturer
Murata
Series
BLM Br
Datasheet
1.BLM21AG350SN1D.pdf
(88 pages)
Specifications of BLM21BB151SH1D
Shielding
Unshielded
Test Frequency
100 MHz
Product
Chip Ferrite Beads
Impedance
150 Ohms
Tolerance
25 %
Maximum Dc Current
200 mAmps
Maximum Dc Resistance
0.25 Ohms
Operating Temperature Range
- 55 C to + 125 C
Package / Case
0805 (2012 metric)
Termination Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BLM21BB151SH1D
Manufacturer:
MURATA
Quantity:
240 000
(1) Soldering Methods
(2) Soldering Profile
!Note
3. Standard Soldering Conditions
oReflow Soldering Profile
oFlow Soldering profile
Use flow and reflow soldering methods only.
Use standard soldering conditions when soldering chip
ferrite beads.
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
Solder: Use Sn-3.0Ag-0.5Cu solder. Use of Sn-Zn based
(Sn-3.0Ag-0.5Cu Solder)
( Sn-3.0Ag-0.5Cu Solder)
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
BLM (Except BLM02/03/15/18G)
BLA31
BLM
BLA
solder will deteriorate performance of products.
If using BLA series with Sn-Zn based solder,
please contact Murata in advance.
Series
Series
220 C min.
Temp. (T1)
Temp. (T1)
150 C
180
150
Heating
T1
Pre-heating
30 to 60s
Time. (t1)
Standard Profile
Time. (t1)
60s min.
Pre-heating
Pre-heating
90s 30s
t1
Temperature
T3
T2
T2
T1
245 3 C
Peak
Temp. (T2)
(T2)
Heating
250 C
t1
t2
t2
Flux:
o Use Rosin-based flux.
o Do not use strong acidic flux (with chlorine content
o Do not use water-soluble flux.
For additional mounting methods, please contact Murata.
Heating
Standard Profile
of Reflow
Time (s)
Time (s)
2 times
In case of using RA type solder, products should be
cleaned completely with no residual flux.
exceeding 0.20wt%)
Cycle
T4
T3
max.
Time. (t2)
4 to 6s
BLp Chip Ferrite Bead
Limit Profile
Standard Profile
Limit Profile
Standard Profile
230 C min.
Temp. (T3)
2 times
of Flow
Cycle
max.
Heating
60s max.
Time. (t2)
Temp. (T3)
265 3 C
Limit Profile
Heating
Temperature
Soldering and Mounting
260 C/10s
Limit Profile
Time. (t2)
Peak
5s max.
(T4)
of Reflow
2 times
Cycle
of Flow
2 times
max.
Cycle
max.
93
Mar.28,2011
C31E.pdf