BLM18TG102TN1D Murata, BLM18TG102TN1D Datasheet - Page 144

EMI/RFI Suppressors & Ferrites 1K OHM LOW SPEED SIGNAL

BLM18TG102TN1D

Manufacturer Part Number
BLM18TG102TN1D
Description
EMI/RFI Suppressors & Ferrites 1K OHM LOW SPEED SIGNAL
Manufacturer
Murata
Datasheet

Specifications of BLM18TG102TN1D

Product
Chip Ferrite Beads
Impedance
1 KOhms
Tolerance
25 %
Maximum Dc Resistance
0.6 Ohms
Package / Case
0603 (1608 metric)
Dc Resistance Max
0.6ohm
Dc Current Rating
100mA
Ferrite Mounting
SMD
Ferrite Case Style
0603 / 1608
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BLM18TG102TN1D
Manufacturer:
MURATA
Quantity:
50 000
Part Number:
BLM18TG102TN1D
Manufacturer:
MURATA/村田
Quantity:
20 000
!Note
142
NFW31S
NFE31P
NFE61P
NFA
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
Series
oGuideline of solder paste thickness:
oGuideline of solder paste thickness:
oGuideline of solder paste thickness:
100-200 m: NFA31G/31C
100-150 m: NFA18S/21S
150-200 m
150-200 m
0.25
NFA21S
NFA18S
NFA31G/31C
0.175
0.5
0.05
Solder Paste Printing
0.3
1.5
0.25
1.375
1.3
2.0
0.4
1.5
4.8
8.8
0.5
2.6
0.6
2.2
4.2
0.225
0.8 Pitch
0.6
Apply 1.0mg of bonding agent at each chip.
NFW31S Series
Apply 0.2mg of bonding agent at each chip.
NFp Chip EMIFILr
Bonding agent
Bonding agent
Adhesive Application
Soldering and Mounting
Bonding agent
1.5
4.8
9.0
Coating positon of
bonding agent
(in mm)
Mar.28,2011
C31E.pdf

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