KUSBLX-SMT-AS1N-B Kycon, KUSBLX-SMT-AS1N-B Datasheet
KUSBLX-SMT-AS1N-B
Manufacturer Part Number
KUSBLX-SMT-AS1N-B
Description
USB & Firewire Connectors A TYPE SMT BLK SKT LOW PROFILE
Manufacturer
Kycon
Datasheet
1.KUSBLX-SMT-AS1N-B.pdf
(1 pages)
Specifications of KUSBLX-SMT-AS1N-B
Product
USB Type A Connectors
Contact Plating
Gold
Contact Material
Phosphor Bronze
Current Rating
1 A
Mounting Style
SMD/SMT
Color
Black
Mounting Angle
Horizontal
Number Of Positions / Contacts
4
Standard
USB
Gender
Female
Connector Type
USB Type A Receptacle
Number Of Ports
1
Flammability Rating
UL 94 V-0
Insulation Resistance
1000 MOhms
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
REV.
A1
KUSBLX-SMT-AS1N-W
KUSBLX-SMT-AS1NW30
KUSBLX-SMT-AS1N-B
KUSBLX-SMT-AS1NB30
KUSBLXSMTAS1NWTR
KUSBLXSMTAS1NW30TR
KUSBLXSMTAS1NBTR
KUSBLXSMTAS1NB30TR
DATE
10/4/05
Part Number
DESCRIPTION
1
New Drawing
14.5
13.10
12.50
14.40
15.70
4
Gold Flash (standard)
Gold Flash (standard)
Gold Flash (standard)
Gold Flash (standard)
30u" Gold (30 option)
30u" Gold (30 option)
30u" Gold (30 option)
30u" Gold (30 option)
REV. BY
R. Aguirre
1.70
CHK. BY
H. MA
DRAWN BY
White
White
Black
Black
White
White
Black
Black
R. Aguirre
9.90
13.10
Bulk (trays, standard)
Bulk (trays, standard)
Bulk (trays, standard)
Bulk (trays, standard)
Tape & Reel (TR option)
Tape & Reel (TR option)
Tape & Reel (TR option)
Tape & Reel (TR option)
8/01/05
UNITS
DATE
mm
connector profile
Packaging
PCB edge
2.22
xxx = color and plating options
0.90 TYP.
0.90
Recommended PCB Layout
2.50
2.50
13.10
(Top View)
0.40
1
14.80
15.70
13.30
2
19.20
14.50
3
2.00
2.00
4
2.50
2.50
PCB
2.00
R0.45
0.10
Insulator: HT thermoplastic,
Shield: brass, 0.30mm thick
Shield Finish: 120u'' nickel plated
Contact Material: phosphor bronze
Contact Plating Options:
Contact Current Rating: 1A max.
Contact Resistance: 30 milliohms max.
Insulation Resistance: 1000 Megohms min.
Dielectric Withstanding Voltage: 500V AC
Insertion Force: 3.57kg max.
Extraction Force: 1.02kg min.
Operating Temperature: -25°C to +80°C
Durability: 1500 mating cycles min.
Reflow Process Compatible-
UL94V-0 rated, black or white color,
Standard: gold flash on contact area,
-30 Option: 30u" gold on contact area,
over 50u'' copper underplate
120u" min. tin on soldertails,
120u" min. tin on soldertails,
Recommended Soldering Temperature:
230°C for 30 seconds, 260°C max.
all over 50u" min. nickel underplate
all over 50u" min. nickel underplate
C
LR78160
US
X.X ± 0.25
X.XX ± 0.15
Unless Stated
Otherwise
Tolerances
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