4170-500ML MG Chemicals, 4170-500ML Datasheet - Page 2

• Manufacturer Part Number: 4170-500ML
• Description: Chemicals NEGATIVE DEVELOPER 16OZ LIQUID
• Manufacturer: MG Chemicals

Specifications of 4170-500ML

• Description/function: Negative Developer
• Product: Prototyping/Board Repair
• Size: 500 ml
• Container: Bottle
• Chemical Component: Potassium Carbonate/Water
• Dispensing Method: Bottle
• Primary Type: Negative Developer
• Special Features: Non-Flammable
• Weight: 17 fl.oz.
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

It is highly recommended to use M.G. Chemicals Negative Developer (Cat. No. 4170-500ML) as it has
been formulated specifically for the Negative Dry Film Resist.
Peel the second protective covering from the board before submerging into solution. Brush board lightly
with foam brush (Cat. No. 416-S) in developer solution. Process should only take 1 – 2 minutes. Visual
inspection required to determine completion.
Rinse Water:
Hard water (150 – 250 ppm CaCo
Drying:
Blow dry thoroughly; hot air preferred.
PART 5: Plating
(acid copper sulfate; tin/lead; tin; nickel; gold)
*Follow plating vendors’ recommendations)
The Negative Dry Film Resist can be used for pattern plate processes with acid copper, tin/lead, tin, nichel
and gold plating baths. This film has very strong resistance to lifting and underplating.
Recommendations: Preplate Cleaning Pocess Sequence
PART 6: Etching
M.G. Chemicals Negative Dry Film Resist is compatible and strongly resistant to most alkaline
ammonical etch process. Excellent adhesion after multiple passes through alkaline machines capable of 4
oz copper.
M.G. Chemicals Negative Dry Film Resist is compatible with most acid etchants, e.g. cupric chloride
(free HCl normally less than or equal to 3.0 N), H
PART 7: Stripping
M.G. Chemicals Negative Dry Film Resist is formulated to dissolve slowly in stripping solution.
Stripping recommendation:
NaOH: 1.5-3 wt%; faster stripping at 3 wt%
KOH: 1.5-3 wt%: faster stripping at 3 wt%
Proprietary Strippers: M.G. Chemicals Cat. No. 435-1L
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Acid cleaner: 38-50◦C (100 - 120◦F); 2-4 minutes
Spray Rinse: 2 minutes
Microetch to remove 0.15-0.25 µm (5-10 µ”) copper (time: as required)
Spray rinse: 2 minutes
Sulfuric acid (5-10 vol%) dip; 1-2 minutes
(Optional: spray rinse; 1-2 minutes
3
) equivalent), or soft water are acceptable
2
O
2
/H
2
SO
4
, and ferric chloride (Cat. No. 415-1L).