SMT3U BusBoard Prototype Systems, SMT3U Datasheet
SMT3U
Manufacturer Part Number
SMT3U
Description
Prototyping Products SMTboard-3U 2 sided
Manufacturer
BusBoard Prototype Systems
Datasheet
1.SMT3U.pdf
(2 pages)
Specifications of SMT3U
Product
Breadboards / Protoboards
Description/function
SMD Prototype PCB
Dimensions
100 mm x 160 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
SMTboard-3U
Prototyping circuit board for 0805, 1206, SOIC, SOT and other SMT parts.
Features
Board Layout (component side)
BusBoard Prototype Systems
www.BusBoard.net
SMT rectangle pads are spaced for 0805 and
1206 components.
SMTboard has three SOIC-32 footprints
each routed to 32 pads.
Solid ground plane on back side for low
noise in RF and high speed logic circuits.
Every second SMT rectangle pad has an
unplated hole for easy connection to the
ground plane on the back side. Just insert a
wire and solder.
Two power rails. Four mounting holes.
SOIC-32 footprints
routed to 32 pads.
Every second SMT pad has
an unplated hole for easy
connection to the ground plane.
Just insert a wire and solder.
sales@busboard.net
SOT-23 footprints
routed to four pads.
- surface mount prototype PCB
Two power rails.
-
Built for designers
SMT pads are spaced
for 0805 and 1206 SMT
components.
SMT pads have 0.1" spacing.
DIP ICs can be soldered to pads.
Standard single height (3U) Eurocard/VME
size.
Twelve SOT23 footprints. SOT223 and
additional SOT23 parts can fit on the SMT
rectangle pads.
SMT rectangle pads have 0.1" spacing to
allow DIP ICs and headers to be attached.
Through hole prototyping area for headers,
power connections, and DIP ICs.
The BusBoard zig-zag circuit pattern on the
through hole area allows easy access to both
sides of headers and DIP ICs.
BPS-MAR-SMT3U-001 Rev 3.00
Through-hole area for
DIP ICs and headers.
Four mounting
holes.
SMT3U Summary of contents
Page 1
... DIP ICs. SMT pads are spaced for 0805 and 1206 SMT components. Two power rails. SMT pads have 0.1" spacing. DIP ICs can be soldered to pads. - Built for designers Through-hole area for DIP ICs and headers. Four mounting holes. BPS-MAR-SMT3U-001 Rev 3.00 ...
Page 2
... ICs or square post headers in through hole area. 0.031" (0.79mm) holes (unplated) for connections to ground plane in SMT area. Order Part# SMT3U or SMT3UT (thin version) Board Layout (ground plane side) Solid ground plane for high-speed logic and RF circuits. ...