421-500ML MG Chemicals, 421-500ML Datasheet

Solder, Fluxes & Accessories LIQUID TIN

421-500ML

Manufacturer Part Number
421-500ML
Description
Solder, Fluxes & Accessories LIQUID TIN
Manufacturer
MG Chemicals
Datasheets
1.421-500ML.pdf (4 pages)
2.421-500ML.pdf (5 pages)

Specifications of 421-500ML

Product
Fluxes & Pastes
Application
For tin plates copper circuits
Boiling Point
100 °C
Chemical Component
Fluoboric Acid, Stannous Fluoroborate, Thiourea
Ph
1
Solubility
100%
Specific Gravity
1.2
Weight
17 oz
Description/function
Liquid Tin
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Product Information Data Sheet
Liquid Tin
PRODUCT DESCRIPTION
Liquid Tin is a clear immersion tin designed and formulated to coat a copper substrate or
solder deposit with a dense tin deposit. This deposit is readily solderable with a long shelf
life. The tin deposit owes its outstanding corrosion protection to its dense coating and
absence of co-deposited organics. Liquid Tin will clean solder deposits and render the
surface active and bright, ensuring good solderabilty. It has the benefit of:
SOLUTION MAKE-UP
Liquid Tin is used at full strength and therefore requires no mixing or dilution.
OPERATING CONDITIONS
Activity
Temperature
Time
Deposition rate
Agitation
RECOMMENDED PROCESS CYCLE
Copper:
The treatment of solder plated parts requires no pre-cleaner, except in cases of severe
contamination of the surface. In these cases, an alkaline soak cleaner, acid soak cleaner,
or a proprietary solder cleaner may be used.
» High metal concentration (4 oz./gallon)
» Clear solution even at room temperature
» Dense tin deposit, long shelf life
» Residues are free rinsing
» Very stable solution
1. Clean board
2. Rinse
3. Liquid Tin
4. Warm water rinse
5. Deionized water rinse
6. Dry
(MG Cat. No. 421)
Nominal
100%
27% (80°F)
5 min.
10 µin/min.
constant mechanical
Range
10 -120%
21 - 60% (70 -140°F)
1-10 min.
3-22 µin/min.

421-500ML Summary of contents

Page 1

... Product Information Data Sheet Liquid Tin (MG Cat. No. 421) PRODUCT DESCRIPTION Liquid Tin is a clear immersion tin designed and formulated to coat a copper substrate or solder deposit with a dense tin deposit. This deposit is readily solderable with a long shelf life. The tin deposit owes its outstanding corrosion protection to its dense coating and absence of co-deposited organics ...

Page 2

... Product Information Data Sheet Liquid Tin (MG Cat. No. 421) BATH OPERATION AND MAINTENANCE Liquid Tin may be used until the activity drops to about 1 0%. Volume lost due to evapora- tion should be replaced with D. I. water. Chemical replenishment of Liquid Tin solutions is not recommended. EQUIPMENT Liquid Tin solutions should be used with equipment constructed of polypropylene, polyeth- ylene, Teflon® ...

Page 3

... Product Information Data Sheet Liquid Tin (MG Cat. No. 421 min Deposition Rate 1 min 2 min 3 min 4 min 5 min ...

Page 4

... Product Information Data Sheet Liquid Tin (MG Cat. No. 421) 2.5 2 1 min 1 min Deposition Rate 2 min 3 min 4 min 5 min ...

Page 5

... Product Information Data Sheet Liquid Tin (MG Cat. No. 421) ANALYTICAL Procedure Number: AP.0532.d I. Procedure Description: Titrimetric method measuring the percent activity of Liquid Tin. II. EQUIPMENT & SETTINGS A. 5.0 mL class “A” pipette B. 50.0 mL burette C. 250 mL Erlenmeyer flask graduated cylinder Ill. REAGENTS acetate buffer - To 245 grams of sodium acetate trihydrate, add Glacial Acetic Acid ...