5202 AIM - American Iron and Metal, 5202 Datasheet
5202
Manufacturer Part Number
5202
Description
Solder, Fluxes & Accessories SN100C BAR TRIANGLE 2.5 lbs. BAR SOLDER
Manufacturer
AIM - American Iron and Metal
Datasheet
1.5202.pdf
(2 pages)
Specifications of 5202
Description/function
Lead Free Bar Solder
Alloy
SN100C
Weight
2.5 lbs
Product
Lead-Free Solder
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
520222610+
Manufacturer:
MOLEX
Quantity:
898
Company:
Part Number:
52025-0411
Manufacturer:
MOLEX
Quantity:
1 892
Company:
Part Number:
52025-0811
Manufacturer:
MOLEX
Quantity:
2 978
Part Number:
5202DN
Manufacturer:
HG
Quantity:
20 000
Rapid
Cooling
Slow
Cooling
Features:
- Bridge-Free Soldering
- Icicle-Free Soldering
- Dross Rate Equal to or Lower than Tin-Lead
Description:
SN100C
offers user-friendly properties and has been proven in commercial production since 1999. The addition of nickel
improves the wetting and flow properties of the cost effective tin-copper eutectic. This makes it possible to achieve
excellent results in wave soldering at process temperatures comparable to the tin-lead solder it replaces.
Performance in wave soldering at least matches that of more expensive silver-containing alloys and the resulting
joints are smoother and brighter. SN100C
Solder Surface Comparison:
Alloy Composition:
Wave Soldering:
The main differences between wave soldering with Sn63/Pb37 tin-lead solder and wave soldering with SN100C
are:
-
-
-
The “process window”; the difference between the process temperature and the melting point of the solder
is smaller.
At the recommended process temperatures the wetting of SN100C
Operators need to ensure that the wave soldering machine is designed to keep board and solder
temperatures within these ranges throughout the process. Use the recommended starting settings as listed
below.
Sn: Balance
Zn: ≤ 0.002
®
Al: ≤ 0.002
Bi: ≤ 0.03
(Sn - 0.7Cu - 0.05Ni + Ge) is a lead-free solder alloy developed by Nihon Superior in Japan. SN100C
Sn63/Pb37
110º-115ºC (230º-239ºF)
Preheat
SN100C
- Does Not Contain Silver or Bismuth
- Smooth, Bright Well-Formed Fillets
Cu: 0.5 - 0.7
Cd: ≤ 0.002
Ag: ≤ 0.05
Sb: ≤ 0.05
®
®
is available in bar, solid and cored wire, and solder paste.
Lead-Free Solder Alloy
SN100C
260º-270ºC (500º-518ºF)
Sn99.3/Cu0.7
Solder Wave
Ni: 0.04 – 0.07
®
As: ≤ 0.03
Fe: ≤ 0.02
Pb: ≤ 0.05
Sn/Ag3.8/Cu0.1
®
is slower.
5 seconds minimum
- Eutectic Alloy
- Slower Rate of Copper Erosion
Dwell Time
from Holes, Pads and Tracks
Sn/Ag3/Cu0.5
(SAC305)
Ge: 0.005-0.007
Au: ≤ 0.05
In: ≤ 0.10
®
®
5202 Summary of contents
Page 1
Features: - Bridge-Free Soldering - Icicle-Free Soldering - Dross Rate Equal to or Lower than Tin-Lead Description: SN100C ® (Sn - 0.7Cu - 0.05Ni + Ge lead-free solder alloy developed by Nihon Superior in Japan. SN100C offers user-friendly ...
Page 2
Safety: - Use with adequate ventilation and proper personal protective equipment. - Refer to the accompanying MSDS for any specific emergency information not dispose of any hazardous materials in non-approved containers. Material Property Melting Temperature [°C] S.G. Specific ...