ATSC4MT1 Amphenol PCD, ATSC4MT1 Datasheet - Page 55

• Manufacturer Part Number: ATSC4MT1
• Description: MARKING TAGS DIN RAIL 6MM
• Manufacturer: Amphenol PCD
• Series: ATSr
• Type: Label, Snap Inr

Specifications of ATSC4MT1

• Legend: Blank
• Pitch: 0.236" (6.00mm)
• For Use With/related Products: ATS Series
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

.100—.375"
3.5—7.5mm
54
Wire-to-board terminal blocks are
one-piece interconnects employed to
connect one or more discrete wires
directly to a printed board. The
blocks are soldered to the board
(both through-hole and SMT technol-
ogy are available) and individual
wires are subsequently connected to
the blocks at any point during equip-
ment manufacturing, installation or
operation, with separable screw ter-
minations.
These blocks are broadly used in
industrial and measurement/control
applications where readily separable
or gang interconnects are not
required and emphasis is on discrete
wires—but flexibility, ease of installa-
tion, reliability, ability to change
connections when required, and low
installation cost are all prime factors.
Different applications require very dif-
ferent terminal blocks. A wide range
of wire-to-board blocks is available
for a variety of significantly different
applications, as described on pages
55--78. Important factors to consider
in block choice are outlined below.
Wire Clamp Reliability
All blocks feature rising cage clamp-
style wire terminations that ensure
direct, high-pressure interconnection
between contact and wire. The rotat-
ing screw does not contact the wire,
and the contact is not bent or
deformed by the screw. Potential wire
strand or contact damage is elimi-
nated, and terminal blocks will
function reliably through repeated
wire connections and re-connections.
Amphenol Pcd
Amphenol Pcd • 2 Technology Drive • Peabody, MA 01960 • www.amphenolpcd.com • 800.333.4723 • [e-mail]
WIRE-TO-BOARD TERMINAL BLOCKS
Surface Mount
The growing popularity of sur face
mount board components—particu-
larly on higher density (.150" and
3.5mm) applications—has created a
need for manufacturers to streamline
board production by performing all
component-to-board solder operations
in a single high-temperature reflow
solder pass that will safely and
securely attach all component
designs—SMT tails and through-hole
solder pins—to the board. Amphenol
Pcd provides two different approaches
in which high density block users can
utilize SMT reflow technology.
The standard .150"/3.5mm ELVM/
ELXM through-hole blocks and varia-
tions shown on pages 60, 61 and 62
are molded of an ultra-high tempera-
ture polyamide, which will withstand
temperatures to 260°C during the
PCB production process, and is com-
patible with SMT reflow soldering as
well as wave soldering processes.
Page 56 depicts the .150"/3.5mm
SMV/X true SMT blocks which com-
bine a rising cage clamp with “L”
style SMT leads.
Modularity
Many of the blocks on pages 55--78
can be provided in 2-- and 3-position
modules that dovetail together to for m
any desired length. Users have the
Moving Cage Clamp
option to order the modules and
assemble-to-length themselves, mini-
mizing inventory, or to specify blocks
to be supplied to specific length.
Where a modular option exists it is
noted on the catalog page.
Variations
Blocks are available in ver tical, hori-
zontal and angled wire-entry
configurations; and are supplied in a
range of sizes, spacings, current rat-
ings and wire-size accommodations.
Black is the standard color, but many
are also available in green. Speci-
fications are provided on each page.
Special hold-down mounting ears for
critical applications, as well as mark-
ing to customer requirement and other
application-specific block modifica-
tions are also available. Contact
Amphenol Pcd to discuss your
requirements.