CSPEMI306AG ON Semiconductor, CSPEMI306AG Datasheet - Page 11
CSPEMI306AG
Manufacturer Part Number
CSPEMI306AG
Description
IC EMI FILTER ARRAY 6CH 15CSP
Manufacturer
ON Semiconductor
Datasheet
1.CSPEMI306AG.pdf
(13 pages)
Specifications of CSPEMI306AG
Resistance (ohms)
100
Capacitance
30pF
Power (watts)
0.1W, 1/10W
Package / Case
15-CSP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Tolerance
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CSPEMI306AG
Manufacturer:
CMD
Quantity:
56 000
Company:
Part Number:
CSPEMI306AG-HST
Manufacturer:
TDK
Quantity:
15 562
CSPEMI306A
Application Information
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
Figure 8.
Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile
Recommended Non-Solder Mask Defined Pad Illustration
N on-Solder M ask D efined Pad
Solder Stencil Opening
Rev. 2 | Page 11 of 13 | www.onsemi.com
Solder Mask Opening
0.240m m D IA.
0.300m m D IA.
0.290m m D IA.
Non-Solder Mask defined pads
OSP (Entek Cu Plus 106A)
0.125mm - 0.150mm
0.290mm Round
0.300mm Round
50/50 by volume
60 seconds
0.240mm
No Clean
VALUE
+50 µ m
+20 µ m
Round
260° C