CSPEMI306AG ON Semiconductor, CSPEMI306AG Datasheet - Page 11

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CSPEMI306AG

Manufacturer Part Number
CSPEMI306AG
Description
IC EMI FILTER ARRAY 6CH 15CSP
Manufacturer
ON Semiconductor
Datasheet

Specifications of CSPEMI306AG

Resistance (ohms)
100
Capacitance
30pF
Power (watts)
0.1W, 1/10W
Package / Case
15-CSP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Tolerance
-

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CSPEMI306A
Application Information
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
Figure 8.
Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile
Recommended Non-Solder Mask Defined Pad Illustration
N on-Solder M ask D efined Pad
Solder Stencil Opening
Rev. 2 | Page 11 of 13 | www.onsemi.com
Solder Mask Opening
0.240m m D IA.
0.300m m D IA.
0.290m m D IA.
Non-Solder Mask defined pads
OSP (Entek Cu Plus 106A)
0.125mm - 0.150mm
0.290mm Round
0.300mm Round
50/50 by volume
60 seconds
0.240mm
No Clean
VALUE
+50 µ m
+20 µ m
Round
260° C

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