STM32F103ZFT6 STMicroelectronics, STM32F103ZFT6 Datasheet - Page 115

• Manufacturer Part Number: STM32F103ZFT6
• Description: MCU ARM 32BIT 769KB FLSH 144LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103ZFT6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 112
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 21x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LFQFP
• Processor Series: STM32F101xF
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 80 KB
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 36 MHz
• Number Of Programmable I/os: 112
• Number Of Timers: 15
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Operating Temperature Range: - 40 C to + 105 C
• Processor To Be Evaluated: STM32F103ZF
• Supply Current (max): 28 mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

STM32F103xF, STM32F103xG
6.2
6.2.1
Thermal characteristics
The maximum chip junction temperature (T
Table 10: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
●
●
●
●
P
taking into account the actual V
application.
Table 69.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
Symbol
I/O

JA
max represents the maximum power dissipation on output pins where:
T

P
P
internal power.
P
A
D
INT
I/O
JA
max is the maximum ambient temperature in °C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in C/W,
max = (V
Thermal resistance junction-ambient
LFBGA144 - 10 × 10 mm / 0.8 mm pitch
Thermal resistance junction-ambient
LQFP144 - 20 × 20 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
max is the product of I
Package thermal characteristics
OL
× I
OL
INT
T
) + ((V
J
Doc ID 16554 Rev 2
max = T
OL
max and P
DD
Parameter
/ I
and V
DD
OL
– V
A
and V
max + (P
DD
OH
I/O
J
J
, expressed in Watts. This is the maximum chip
max) must never exceed the values given in
max, in degrees Celsius, may be calculated
OH
) × I
max (P
41.
/ I
OH
D
OH
),
max x 
D
of the I/Os at low and high level in the
max = P
JA
)
INT
Package characteristics
max + P
Value
40
30
46
45
I/O
max),
115/120
°C/W
Unit