SI3011-F-FS Silicon Laboratories Inc, SI3011-F-FS Datasheet - Page 124

• Manufacturer Part Number: SI3011-F-FS
• Description: IC VOICE DAA GCI/PCM/SPI 16SOIC
• Manufacturer: Silicon Laboratories Inc

Specifications of SI3011-F-FS

• Includes: Line Voltage Monitor, Loop Current Monitor, Overload Detection, Parallel Handset Detection, Polarity Reversal Detection, TIP and
• Function: Data Access Arrangement (DAA)
• Interface: PCM, Serial, SPI
• Number Of Circuits: 1
• Voltage - Supply: 3 V ~ 3.6 V
• Current - Supply: 8.5mA
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Si3050 + Si3011/18/19
124
Table 37. 20-Pin Quad Flat No-Lead (QFN) PCB Land Pattern Dimensions
Dimension
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in milllimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on IPC-SM-782 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material
1. All pads are to be non-solder mask defined (NSMD). Clearance between the solder
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
4. A 1.45 x 1.45 mm square aperture should be used for the center pad. This provides
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
mask and the metal pad is to be 60  m minimum, all the way around the pad.
used to assure good solder paste release.
approximately 70% solder paste coverage on the pad, which is optimum to assure
correct component stand-off.
for Small Body Components.
GD
GE
ZD
D2
E2
ZE
W
D
e
E
X
Y
f
1.60
1.60
2.10
MIN
2.10
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Rev. 1.5
0.50 BSC
2.53 BSC
2.71 REF
2.71 REF
0.61 REF
MAX
1.80
1.80
0.34
0.28
3.31
3.31
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