MC74HC367ADTR2G ON Semiconductor, MC74HC367ADTR2G Datasheet - Page 5

• Manufacturer Part Number: MC74HC367ADTR2G
• Description: IC BUFFER 3ST HEX 16-TSSOP
• Manufacturer: ON Semiconductor

Specifications of MC74HC367ADTR2G

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

SEATING
PLANE
16
−T
1
−
H
16
1
−A
G
−
G
D
16 PL
−A
−
0.25 (0.010)
F
D
9
8
16 PL
0.25 (0.010)
S
B
M
9
8
K
T B
K
M
C
−B
−
−T
−
T A
S
C
SEATING
PLANE
P
OUTLINE DIMENSIONS
M
A
PLASTIC SOIC PACKAGE
8 PL
S
http://onsemi.com
PLASTIC PACKAGE
0.25 (0.010)
J
CASE 751B−05
CASE 648−08
M
N SUFFIX
D SUFFIX
ISSUE R
ISSUE J
5
M
L
R
X 45°
B
M
M
J
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
Y14.5M, 1982.
FORMED PARALLEL.
DIM
A
B
C
D
G
H
K
M
F
J
L
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
0.740
0.250
0.145
0.015
0.040
0.008
0.110
0.295
0.020
MIN
DIM
M
A
B
C
D
F
G
K
P
R
J
0°
INCHES
0.100 BSC
0.050 BSC
MILLIMETERS
0.770
0.270
0.175
0.021
0.070
0.015
0.130
0.305
0.040
MIN
MAX
9.80
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
10°
0°
1.27 BSC
10.00
MAX
MILLIMETERS
18.80
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
MIN
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
7°
0°
2.54 BSC
1.27 BSC
0.386
0.150
0.054
0.014
0.016
0.008
0.004
0.229
0.010
19.55
MAX
MIN
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
10°
0.050 BSC
0°
INCHES
0.393
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
MAX
7°