74CBTLV3253D,118 NXP Semiconductors, 74CBTLV3253D,118 Datasheet - Page 3

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74CBTLV3253D,118

Manufacturer Part Number
74CBTLV3253D,118
Description
IC MUX/DEMUX DUAL 1OF4 16SOIC
Manufacturer
NXP Semiconductors
Datasheet

Specifications of 74CBTLV3253D,118

Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-5266-2
NXP Semiconductors
5. Pinning information
Table 2.
74CBTLV3253
Product data sheet
Symbol
1OE, 2OE
S0, S1
1B1 to 1B4
2B1 to 2B4
GND
1A, 2A
V
Fig 2.
CC
GND
1OE
1B4
1B3
1B2
1B1
S1
1A
Pin configuration
SOT109-1 (SO16) and
SOT519-1 (SSOP16)
1
2
3
4
5
6
7
8
Pin description
74CBTLV3253
5.1 Pinning
5.2 Pin description
001aal209
8
Pin
1, 15
14, 2
6, 5, 4, 3
10, 11, 12, 13
7, 9
16
16
15
14
13
12
11
10
9
V
2OE
S0
2B4
2B3
2B2
2B1
2A
CC
All information provided in this document is subject to legal disclaimers.
Fig 3.
GND
1OE
1B4
1B3
1B2
1B1
S1
1A
1
2
3
4
5
6
7
8
Description
output enable input (active LOW)
select input
B input/output
B input/output
ground (0 V)
A input/output
supply voltage
Rev. 3 — 7 January 2011
Pin configuration
SOT403-1 (TSSOP16)
74CBTLV3253
001aal210
16
15
14
13
12
11
10
9
V
2OE
S0
2B4
2B3
2B2
2B1
2A
CC
Dual 1-of-4 multiplexer/demultiplexer
Fig 4.
index area
terminal 1
(1) This is not a supply pin. The
74CBTLV3253
1B4
1B3
1B2
1B1
S1
1A
substrate is attached to this pad
using conductive die attach
material. There is no electrical or
mechanical requirement to
solder this pad. However, if it is
soldered, the solder land should
remain floating or be connected
to GND.
Pin configuration
SOT763-1 (DHVQFN16)
Transparent top view
2
3
4
5
6
7
74CBTLV3253
GND
© NXP B.V. 2011. All rights reserved.
(1)
15
14
13
12
11
10
001aal211
2OE
S0
2B4
2B3
2B2
2B1
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