AT24C64D-MAHM-T Atmel, AT24C64D-MAHM-T Datasheet - Page 18
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AT24C64D-MAHM-T
Manufacturer Part Number
AT24C64D-MAHM-T
Description
IC EEPROM SER 64K 2-WIRE 8UDFN
Manufacturer
Atmel
Datasheet
1.AT24C64D-SSHM-T.pdf
(26 pages)
Specifications of AT24C64D-MAHM-T
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
64K (8K x 8)
Speed
400kHz, 1MHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
1.7 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-UFDFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT24C64D-MAHM-T
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
18
Atmel AT24C64D Ordering Information
Notes:
AT24C64D-SSHM-B
AT24C64D-SSHM-T
AT24C64D-XHM-B
AT24C64D-XHM-T
AT24C64D-MAHM-T
AT24C64D-MEHM-T
AT24C64D-CUM-T
AT24C64D-WWU11M
8S1
8A2
8Y6
8ME1
8U3-1
Atmel AT24C32D/64D
Ordering Code
1. “-B” denotes bulk delivery
2. “-T” denotes tape and reel delivery. SOIC = 4K/reel. TSSOP, UDFN, XDFN, SOT23 and VFBGA = 5K/reel
3. For Wafer sales, please contact Atmel Sales
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4mm Body, Plastic, Thin Shrink Small Outline Package (TSSOP)
8-lead, 2.00mm x 3.00mm Body, 0.50mm Pitch, Ultra Thin Dual no Lead Package (UDFN)
8-lead, 1.80mm x 2.20mm Body, (XDFN)
8-ball, 1.50mm x 2.00mm Body, 0.50mm Pitch, Small Die Ball Grid Array (VFBGA)
(2)
(1)
(2)
(2)
(1)
(2)
(2)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(3)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
(NiPdAu Lead Finish)
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
Voltage
Package Type
Die Sale
Package
8U3-1
8ME1
8S1
8S1
8A2
8A2
8Y6
Lead-free/Halogen-free
Industrial Temperature
Industrial Temperature
Operation Range
(-40C to +85C)
(-40C to +85C)
8717B–SEEPR–6/10