RT9301GJ8 Richtek USA Inc, RT9301GJ8 Datasheet - Page 8

• Manufacturer Part Number: RT9301GJ8
• Description: IC LED DVR 3CH RGB TSOT23-8
• Manufacturer: Richtek USA Inc

Specifications of RT9301GJ8

• Internal Driver: Yes
• Type - Primary: Backlight, Flash/Torch
• Type - Secondary: RGB, White LED
• Mounting Type: Surface Mount
• Number Of Outputs: 3
• Voltage - Supply: 2.8 V ~ 5.5 V
• Package / Case: SOT-23-8 Thin, TSOT-23-8
• Operating Temperature: -40°C ~ 85°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Topology: -
• Frequency: -
• Voltage - Output: -

RT9301
Layout Consideration
For best performance, careful PCB layout is necessary.
Place all peripheral components as close to the IC as
possible. A short connection is highly recommended. The
following guidelines should be strictly followed when
designing a PCB layout for the RT9301.
1. All the traces of LED and VIN pin running from chip to
2. Input capacitor (C
3. Current setting resistors R
4. The GND should be connected to a strong ground plane
5. The current setting resistors should be placed as close
www.richtek.com
8
LEDs should be wide and short to reduce the parasitic
connection resistance.
connected to ground plane. The anodes of LEDs must
be connected to C
to the chip as possible.
for heat sinking and noise protection.
to the IC as possible.
Figure 6. Derating Curves for RT9301 Packages
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
1
0
0
25
Ambient Temperature (°C)
IN
IN
) must be placed close to LEDs and
, not battery directly.
TSOT-23-8
50
SET
WDFN-8L 3x3
should be placed as close
75
Single Layer PCB
100
125
All the traces of LED and VIN running from chip
to LEDs should be wide and short to reduce the
parasitic connection resistance.
Input capacitor (C
should be placed
close to LEDs Pin
and connected to
ground plane. The
Anodes of LEDs
must connect to C
not battery directly.
Figure 8. Recommended PCB Layout of WDFN-8L 3x3
Grand Plane
Figure 7. ecommended PCB Layout of TSOT-23-8
The GND should be connected to a strong
ground plane for heat sinking and noise
protection.
Battery
ISET1
ISET2
Ground Plane
LED2
LED1
IN
IN
)
,
1
2
3
4
All the traces of LED and V
chip to LEDs should be wide and short to
reduce the parasitic connection resistance.
The GND should be connected to a strong
ground plane for heat sinking and noise
protection.
ISET3
LED3
GND
Package
Package
VIN
8
7
6
5
LED3
GND
VIN
ISET3
1
3
2
4
DS9301-04 June 2009
8
7
6
5
Battery
IN
LED2
LED1
ISET1
ISET2
Input capacitor
(CIN) should
be placed close to
LEDs Pin and
connected to
ground plane. The
Anodes of LEDs
must connect to
CIN, not battery
directly.
running from