AS1324-BTTT-18 austriamicrosystems, AS1324-BTTT-18 Datasheet - Page 3

• Manufacturer Part Number: AS1324-BTTT-18
• Description: IC CONV BOOST 1.8V SOT23-5
• Manufacturer: austriamicrosystems
• Type: Step-Down (Buck), PWM - Current Moder

Specifications of AS1324-BTTT-18

• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 1.8V
• Current - Output: 600mA
• Frequency - Switching: 1.5MHz
• Voltage - Input: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SOT-23-5 Thin, TSOT-23-5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: AS1324-BTTT-18TR

AS1324
Datasheet - A b s o l u t e M a x i m u m R a t i n g s
5 Absolute Maximum Ratings
Stresses beyond those listed in
the device at these or any other conditions beyond those indicated in
absolute maximum rating conditions for extended periods may affect device reliability.
Table 3. Absolute Maximum Ratings
www.austriamicrosystems.com/DC-DC_Step-Down/AS1324
Operating Temperature Range
Storage Temperature Range
Package Body Temperature
Thermal Resistance Θ
Junction Temperature
SW, EN, FB to GND
VIN to GND
Parameter
Latch-Up
ESD
Table 3
JA
may cause permanent damage to the device. These are stress ratings only, and functional operation of
-100
Min
-0.3
-0.3
-40
-65
2
207.4
+ 0.3
+100
+125
+260
Max
Revision 1.05
+85
V
125
6
IN
Section 6 Electrical Characteristics on page 4
Units
ºC/W
mA
kV
ºC
ºC
ºC
ºC
V
V
Junction temperature (T
ambient temperature (T
(PD) as:
The lead finish for Pb-free leaded packages is matte tin
Classification for Non-Hermetic Solid State Surface
temperature) specified is in accordance with IPC/
JEDEC J-STD-020 “Moisture/Reflow Sensitivity
The reflow peak soldering temperature (body
HBM MIL-Std. 883E 3015.7 methods
T
J
= T
AMB
Mount Devices”.
+ (PD)(207.4ºC/W)
Comments
(100% Sn).
JEDEC 78
AMB
on PCB
J
) is calculated from the
is not implied. Exposure to
) and power dissipation
(EQ 1)
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