EVAL-ADF4113EBZ1 Analog Devices Inc, EVAL-ADF4113EBZ1 Datasheet - Page 28

• Manufacturer Part Number: EVAL-ADF4113EBZ1
• Description: BOARD EVAL FOR ADF4113
• Manufacturer: Analog Devices Inc

Specifications of EVAL-ADF4113EBZ1

• Main Purpose: Timing, Frequency Synthesizer
• Embedded: No
• Utilized Ic / Part: ADF4113
• Primary Attributes: Single Integer-N PLL
• Secondary Attributes: 1.75GHz, Graphical User Interface
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADF4110/ADF4111/ADF4112/ADF4113
ORDERING GUIDE
Model
ADF4110BRU
ADF4110BRU-REEL
ADF4110BRU-REEL7
ADF4110BCP
ADF4110BCP -REEL
ADF4110BCP-REEL7
ADF4111BRU
ADF4111BRU-REEL
ADF4111BRU-REEL7
ADF4111BCP
ADF4111BCP-REEL
ADF4111BCP-REEL7
ADF4112BRU
ADF4112BRU-REEL
ADF4112BRU-REEL7
ADF4112BRUZ
ADF4112BRUZ
ADF4112BRUZ
ADF4112BCP
ADF4112BCP-REEL
ADF4112BCP-REEL7
ADF4113BRU
ADF4113BRU-REEL
ADF4113BRU-REEL7
ADF4113BRUZ
ADF4113BRUZ
ADF4113BRUZ
ADF4113BCP
ADF4113BCP-REEL
ADF4113BCP-REEL7
ADF4113BCHIPS
EVAL-ADF4112EB1
EVAL-ADF4113EB1
EVAL-ADF4113EB2
EVAL-ADF411XEB1
1
Purchase of licensed I
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = Pb-free part.
Rights to use these components in an I
1
1
1
1
1
1
-REEL
-REEL7
-REEL
-REEL7
2
C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I
2
C system, provided that the system conforms to the I
Temperature Range
–40°C to +85°C
–40°C to +85°C
-40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
C03496–0–3/04(C)
Rev. C | Page 28 of 28
Package Description
Thin Shrink Small Outline Package
Thin Shrink Small Outline Package
Thin Shrink Small Outline Package
Lead Frame Chip Scale Package
Lead Frame Chip Scale Package
Lead Frame Chip Scale Package
Thin Shrink Small Outline Package
Thin Shrink Small Outline Package
Thin Shrink Small Outline Package
Lead Frame Chip Scale Package
Lead Frame Chip Scale Package
Lead Frame Chip Scale Package
Thin Shrink Small Outline Package
Thin Shrink Small Outline Package
Thin Shrink Small Outline Package
Thin Shrink Small Outline Package
Thin Shrink Small Outline Package
Thin Shrink Small Outline Package
Lead Frame Chip Scale Package
Lead Frame Chip Scale Package
Lead Frame Chip Scale Package
Thin Shrink Small Outline Package
Thin Shrink Small Outline Package
Thin Shrink Small Outline Package
Thin Shrink Small Outline Package
Thin Shrink Small Outline Package
Thin Shrink Small Outline Package
Lead Frame Chip Scale Package
Lead Frame Chip Scale Package
Lead Frame Chip Scale Package
DIE
Evaluation Board
Evaluation Board
Evaluation Board
Evaluation Board
2
C Standard Specification as defined by Philips.
Package Option
RU-16
RU-16
RU-16
CP-20
CP-20
CP-20
RU-16
RU-16
RU-16
CP-20
CP-20
CP-20
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
CP-20
CP-20
CP-20
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
CP-20
CP-20
CP-20
2
C Patent