EVAL-ADF4153EBZ1 Analog Devices Inc, EVAL-ADF4153EBZ1 Datasheet - Page 24

• Manufacturer Part Number: EVAL-ADF4153EBZ1
• Description: BOARD EVAL FOR ADF4153
• Manufacturer: Analog Devices Inc

Specifications of EVAL-ADF4153EBZ1

• Main Purpose: Timing, Frequency Synthesizer
• Embedded: No
• Utilized Ic / Part: ADF4153
• Primary Attributes: Single Fractional-N PLL
• Secondary Attributes: 1.75GHz, Graphical User Interface
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADF4153
ORDERING GUIDE
Model
ADF4153BRU
ADF4153BRU-REEL7
ADF4153BRUZ
ADF4153BRUZ-RL
ADF4153BRUZ-RL7
ADF4153YRUZ
ADF4153YRUZ-RL
ADF4153YRUZ-RL7
ADF4153BCP
ADF4153BCP-REEL
ADF4153BCP-REEL7
ADF4153BCPZ
ADF4153BCPZ-RL
ADF4153BCPZ-RL7
ADF4153YCPZ
ADF4153YCPZ-RL
ADF4153YCPZ-RL7
ADF4153WYRUZ-R7
EVAL-ADF4153EBZ1
1
2
AUTOMOTIVE PRODUCTS
The ADF4153W models are available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
©2003–2010 Analog Devices, Inc. All rights reserved. Trademarks and
I
registered trademarks are the property of their respective owners.
2
Z = RoHS Compliant Part.
W = Qualified for Automotive Applications.
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
1, 2
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
D03685-0-8/10(D)
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Lead Thin Shrink Small Outline Package [TSSOP]
Package Description
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Evaluation Board
Rev. D | Page 24 of 24
Package Option
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
CP-20-1
CP-20-1
CP-20-1
CP-20-1
CP-20-1
CP-20-1
CP-20-1
CP-20-1
CP-20-1
RU-16