MXHS83QE3000 Murata Electronics North America, MXHS83QE3000 Datasheet - Page 8
![TEST PROBE MANUL FOR MM8430-8130](/photos/2/30/23065/mxhs83qe3000_sml.jpg)
MXHS83QE3000
Manufacturer Part Number
MXHS83QE3000
Description
TEST PROBE MANUL FOR MM8430-8130
Manufacturer
Murata Electronics North America
Datasheet
1.MXHS83QE3000.pdf
(39 pages)
Specifications of MXHS83QE3000
Accessory Type
Measurement Probe
Features
Locking
For Use With/related Products
SWD and SWF Connectors
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
490-4982
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MXHS83QE3000
Manufacturer:
MURATA
Quantity:
10 000
1
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Reflow soldering
2. Soldering by soldering iron
3. We cannot warrant against mishaps caused by any use
4. In soldering, do not apply excessive mechanical force to
5. Please note the following in case of soldering terminals
6. Please mount this product at the position so that stress
7. Please avoid the cleaning of this product.
6
Notice
(1) Use Rosin based flux, but not with strong acid flux
(2) Flux should be thoroughly cleaned from connector to
Notice (Soldering and Mounting)
Soldering must be carried out without exceeding the
allowable soldering temperature and time shown within
the shaded area of Figure "Allowable Temperature and
Time of Reflow Soldering".
In case the soldering is repeated, the maximum time in
Figure "Allowable Temperature and Time of Reflow
Soldering" should be accumulated time. The standard
soldering conditions are shown in Figure "Reflow
Soldering Standard Conditions".
Follow standard solder stencil mask pattern to avoid the
possibility of solder being trapped under connector.
Soldering by soldering iron should be carried out in
accordance to the following conditions.
of this product that deviates from allowable temperature
and time of reflow soldering.
terminals or leads greater than specified in the drawing.
or leads of the product.
by wrap and/or bend of the PCB may not apply to it.
Pre-heating
Soldering
(Chlorine content should be less than 0.20wt%).
prevent possible deterioration of electrical
characteristics.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Temperature
Time
Temperature (at the tip of the soldering
iron) less than 350D
Time
150D
60 to 120 s.
less than 3 s.
Measuring point of temperature: In-Out Terminals of the Device
Reflow Soldering: Both Convection and Infrared Rays
Allowable Temperature and Time of Reflow Soldering
Reflow Soldering Standard Conditions
240
230
150
100
25
260
250
240
230
220
210
200
190
180
0
Pre-heating 150 20D
: Hot Air
: Hot Plate
30
60-120 sec.
60
Time (sec.)
90
120
Continued on the following page.
Peak temperature 250 5D
150
30-50 sec.
Solder: Sn-3.0Ag-0.5Cu
180
30 sec. max.
210
Time (sec.)
240
O30E.pdf
07.9.3