GRM31MF51E105ZA01L Murata, GRM31MF51E105ZA01L Datasheet - Page 214
![Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 1206 1uF 25volts Y5V +80-20%](/photos/16/29/162950/055p01_sml.jpg)
GRM31MF51E105ZA01L
Manufacturer Part Number
GRM31MF51E105ZA01L
Description
Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 1206 1uF 25volts Y5V +80-20%
Manufacturer
Murata
Series
GRMr
Datasheet
1.GNM1M2R61A105ME14D.pdf
(221 pages)
Specifications of GRM31MF51E105ZA01L
Voltage Rating
25 Volts
Operating Temperature Range
- 30 C to + 85 C
Temperature Coefficient / Code
Y5V
Product
General Type MLCCs
Dimensions
1.6 mm W x 3.2 mm L x 1.15 mm H
Termination Style
SMD/SMT
Capacitance
1 uF
Tolerance
- 20 %, 80 %
Package / Case
1206 (3216 metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
6. Correction with a Soldering Iron
Table 3
7. Washing
FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY
RESULT, WORST CASE, IN A SHORT CIRCUIT AND
FUMING WHEN THE PRODUCT IS USED.
G--18/21/31
G--32/42/43/
52/55
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Part Number
Optimum Solder Amount when re-working Using a
When sudden heat is applied to the components by use
of a soldering iron, the mechanical strength of the
components will decrease because the extreme
temperature change causes deformations inside the
components.
In order to prevent mechanical damage to the
components, preheating is required for both the
components and the PCB board.
Preheating conditions, (The "Temperature of the
Soldering Iron Tip", "Preheating Temperature,"
"Temperature Differential" between iron tip and the
Soldering Iron
For sizes smaller than Gpp18, the top of the solder fillet
should be lower than 2/3 of the thickness of the
component or 0.5mm whichever is smaller.
For sizes larger than Gpp21, the top of the solder fillet
should be lower than 2/3 of the thickness of the
component.
If the solder amount is excessive, the risk of cracking is
higher during board bending or under any other stressful
conditions.
A Soldering iron ø3mm or smaller should be used.
It is also necessary to keep the soldering iron from
touching the components during the re-work.
Solder wire with ø0.5mm or smaller is required for
soldering.
Excessive output of ultrasonic oscillation during cleaning
causes PCBs to resonate, resulting in cracked chips or
broken solder. Take note not to vibrate PCBs.
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Temperature
of Soldering
350 C max.
280 C max.
Iron tip
Temperature
150 C min.
150 C min.
Preheating
Temperature
Differential
TV190D
TV130D
( T)
Atmosphere
air
air
components and the PCB), should be within the
conditions of table 3.
It is required to keep the temperature differential between
the soldering Iron and the component's surface ( T) as
small as possible.
After soldering, do not allow the component/PCB to cool
down rapidly.
The operating time for the re-working should be as short
as possible. When re-working time is too long, it may
cause solder leaching, in turn causing a reduction of the
adhesive strength of the terminations.
Solder Amount
!Caution
in section
213
C02E.pdf
10.12.20
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