GRM21AR72E332KW01D Murata, GRM21AR72E332KW01D Datasheet - Page 142
![Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 0805 3300pF 250volts X7R 10%](/photos/16/29/162950/055p01_sml.jpg)
GRM21AR72E332KW01D
Manufacturer Part Number
GRM21AR72E332KW01D
Description
Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 0805 3300pF 250volts X7R 10%
Manufacturer
Murata
Series
GRMr
Datasheet
1.GNM1M2R61A105ME14D.pdf
(221 pages)
Specifications of GRM21AR72E332KW01D
Voltage Rating
250 Volts
Operating Temperature Range
- 55 C to + 125 C
Temperature Coefficient / Code
X7R
Product
General Type MLCCs
Dimensions
1.25 mm W x 2 mm L x 1 mm H
Termination Style
SMD/SMT
Capacitance
3300 pF
Tolerance
10 %
Package / Case
0805 (2012 metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
GRM21AR72E332KW01D
Manufacturer:
MURATA
Quantity:
640 000
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!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
4-3. Correction with a Soldering Iron
1. When sudden heat is applied to the components when
2. After soldering, do not allow the component/PCB to
3. The operating time for the re-working should be as short
4. Optimum Solder amount when re-working with a
4-4. Leaded Component Insertion
1. If the PCB is flexed when leaded components (such as
5. Washing
Excessive ultrasonic oscillation during cleaning can cause
the PCBs to resonate, resulting in cracked chips or broken
solder joints. Take note not to vibrate PCBs.
140
!Caution
!Caution
using a soldering iron, the mechanical strength of the
components will decrease because the extreme
temperature change can cause deformations inside the
components. In order to prevent mechanical damage to
the components, preheating is required for both the
components and the PCB board. Preheating conditions,
(The "Temperature of the Soldering Iron Tip", "Preheating
Temperature," "Temperature Differential" between the
iron tip and the components and the PCB), should be
within the conditions of table 3. It is required to keep the
temperature differential between the soldering iron and
the component surfaces ( T) as small as possible.
rapidly cool down.
as possible. When re-working time is too long, it may
cause solder leaching, in turn causing a reduction in the
adhesive strength of the terminations.
Soldering lron
4-1. For sizes smaller than 0603, (GRM03/15/18,
4-2. A soldering iron with a tip of ø3mm or smaller should
4-3. Solder wire with ø0.5mm or smaller is required for
transformers and ICs) are being mounted, chips may
crack and solder joints may break.
Before mounting leaded components, support the PCB
using backup pins or special jigs to prevent warping.
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
GJM03/15, GQM18), the top of the solder fillet
should be lower than 2/3's of the thickness of the
component or 0.5mm whichever is smaller. For 0805
and larger sizes, (GRM21/31/32/43/55, GQM21/22),
the top of the solder fillet should be lower than 2/3's
of the thickness of the component. If the solder
amount is excessive, the risk of cracking is higher
during board bending or under any other stressful
condition.
be used. It is also necessary to keep the soldering
iron from touching the components during the
re-work.
soldering.
Table 3
GRM03/15/18/21/31
GJM03/15
GQM18/21
GRM32/43/55
GQM22
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Part Number
350 C max.
280 C max.
Temperature
of Soldering
Iron Tip
Temperature
150 C min.
150 C min.
Preheating
Continued on the following page.
Temperature
Differential
TV190 C
TV130 C
Solder Amount
( T)
Atmosphere
in section
Air
Air
C02E.pdf
10.12.20
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