GRM155R71H392KA01D Murata, GRM155R71H392KA01D Datasheet - Page 149
![Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 0402 3900pF 50volts X7R 10%](/photos/16/29/162950/055p01_sml.jpg)
GRM155R71H392KA01D
Manufacturer Part Number
GRM155R71H392KA01D
Description
Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 0402 3900pF 50volts X7R 10%
Manufacturer
Murata
Series
GRMr
Datasheet
1.GNM1M2R61A105ME14D.pdf
(221 pages)
Specifications of GRM155R71H392KA01D
Voltage Rating
50 Volts
Operating Temperature Range
- 55 C to + 125 C
Temperature Coefficient / Code
X7R
Product
General Type MLCCs
Dimensions
0.5 mm W x 1 mm L x 0.5 mm H
Termination Style
SMD/SMT
Capacitance
3900 pF
Tolerance
10 %
Package / Case
0402 (1005 metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
GRM155R71H392KA01D
Manufacturer:
MURATA
Quantity:
230 000
Part Number:
GRM155R71H392KA01D
Manufacturer:
MURATA/村田
Quantity:
20 000
- Current page: 149 of 221
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!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
Table 3 GNM, LLA Series for Reflow Soldering Land Dimensions
Table 4 LLM Series for Reflow Soldering Land Dimensions
2. Adhesive Application
1. Thin or insufficient adhesive can cause the chips to
2. Low viscosity adhesive can cause chips to slip after
3. Adhesive Coverage
Notice
GNMpp2
LLM
loosen or become disconnected during flow soldering.
The amount of adhesive must be more than dimension c,
shown in the drawing at right, to obtain the correct
bonding strength.
The chip's electrode thickness and land thickness must
also be taken into consideration.
mounting. The adhesive must have a viscosity of
5000Pa
Continued from the preceding page.
GRM18, GQM18
GRM21, LLL21, GQM21
GRM31, LLL31
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Part Number
Part Number
Part Number
•
GNM0M2
GNM1M2
s (500ps) min. (at 25 C).
GNM212
GNM214
GNM314
e
LLM21
LLM31
LLA18
LLA21
LLA31
a
Chip Capacitor
c
p
Chip Capacitor
p
d
f
0.6 to 0.8
Adhesive Coverage*
Land
1.0
c
1.37
a
0.9
2.0
2.0
3.2
1.6
2.0
3.2
L
0.05mg min.
0.15mg min.
0.1mg min.
b'
a
b
b
b=(c-e)/2, b'=(d-f)/2
c'
*Nominal Value
(0.3 to 0.5)
(0.3 to 0.5)
b, b'
1.25
1.25
1.25
0.6
1.0
1.6
0.8
1.6
W
c, c'
0.3
0.4
0.12 to 0.20*
0.4 to 0.5
0.6 to 0.7
0.6 to 0.7
0.8 to 1.0
0.3 to 0.4
0.5 to 0.7
0.7 to 0.9
GNMpp4
LLA
a
Dimensions (mm)
Dimensions (mm)
* 0.82Va+2bV1.00
2.0 to 2.6
3.2 to 3.6
Board
d
0.35 to 0.40*
0.35 to 0.45
0.25 to 0.35
0.35 to 0.6
0.5 to 0.7
0.5 to 0.7
0.7 to 0.9
0.4 to 0.7
b
c
1.3 to 1.8
1.6 to 2.0
Chip Capacitor
Chip Capacitor
e
Land
p
Adhesive
0.25 to 0.35
0.15 to 0.25
0.3 to 0.35
0.4 to 0.5
0.3 to 0.4
0.2 to 0.3
0.3 to 0.4
Continued on the following page.
0.3
1.4 to 1.6
c
Land
2.6
f
a=20 to 70 m
b=30 to 35 m
c=50 to 105 m
a
b
a
b
Notice
0.45
0.64
1.0
0.5
0.8
0.4
0.5
0.8
c
p
0.5
0.8
p
147
C02E.pdf
10.12.20
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