LIS3LV02DLTR STMicroelectronics, LIS3LV02DLTR Datasheet - Page 46

• Manufacturer Part Number: LIS3LV02DLTR
• Description: IC MEMS INERTL SENSOR 3AX LGA16
• Manufacturer: STMicroelectronics

Specifications of LIS3LV02DLTR

• Featured Product: STM32 Cortex-M3 Companion Products
• Axis: X, Y, Z
• Acceleration Range: ±2g, 6g
• Sensitivity: 1024LSB/g, 340LSB/g
• Voltage - Supply: 2.16 V ~ 3.6 V
• Output Type: Digital
• Bandwidth: 40Hz ~ 2.56kHz Selectable
• Interface: I²C, SPI
• Mounting Type: Surface Mount
• Package / Case: 16-LGA
• Family Name: LIS3LV02DL
• Package Type: LGA
• Operating Supply Voltage (min): 2.16V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Product Depth (mm): 4.4mm
• Product Length (mm): 7.5mm
• Mounting: Surface Mount
• Pin Count: 16
• Sensing Axis: X, Y, Z
• Acceleration: 2 g, 6 g
• Digital Output - Number Of Bits: 12 bit, 16 bit
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.16 V
• Supply Current: 0.65 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Digital Output - Bus Interface: I2C, SPI
• For Use With: 497-8261 - BOARD EVAL BASED ON LIS3LV02DL497-5069 - EVAL BOARD 3AXIS MEMS ACCELLRMTR
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-8415-2; LIS3LV02DLTR

Package information
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Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK
ECOPACK
Figure 28. LGA-16 mechanical data and package dimensions
®
DIM.
A1
A2
A3
D1
E1
N1
P1
P2
L1
T1
T2
Metal Pad
Detail A
N
R
e
d
h
k
s
i
specifications are available at: www.st.com.
D1
0.180
4.250
7.350
0.965
1.200
MIN.
0.64
0.75
0.45
(4 x)
i
B
k
i
A
C
C
A
A
B
0.220
4.400
7.500
5.000
0.975
0.150
0.050
0.100
0.100
TYP.
0.92
0.65
mm
B
1.0
0.3
2.5
1.2
0.8
0.5
E
P2
MAX.
0.260 0.0071 0.0087 0.0102
4.550 0.1673 0.1732 0.1791
7.650 0.2894 0.2953 0.3012
0.985 0.0380 0.0384 0.0388
1.600 0.0472
0.66
0.85
0.55
0.7
1
E1
Solder mask
opening
0.0252 0.0256 0.0260
0.0295 0.0315 0.0335
0.0177 0.0197 0.0217
MIN.
h
C
k
A
0.0394
0.0118
0.1969
0.0984
0.0472
0.0059
0.0020
0.0039
0.0039
D
TYP.
B
inch
D
k
0.0394
0.0276
0.0630
P1
E
seating plane
MAX.
h
C
A
B
A3
R
A2
A1
i
i
C
Land Grid Array Package
LGA16 (4.4x7.5x1mm)
MECHANICAL DATA
Detail A
N1
e
OUTLINE AND
d
®
16
15
is an ST trademark.
14
1
E
13
2
N
12
3
L1
11
4
e
10
5
6
9
7863679 B
T2
7
8
s
D
LIS3LV02DL
T1
®