0-1003800-5 Measurement Specialties Inc/Schaevitz, 0-1003800-5 Datasheet - Page 9

• Manufacturer Part Number: 0-1003800-5
• Description: SENSOR ACCELEROMETER 3-AXIS SMD
• Manufacturer: Measurement Specialties Inc/Schaevitz

Specifications of 0-1003800-5

• Rohs Status: RoHS non-compliant
• Axis: X, Y, Z
• Acceleration Range: ±250g
• Sensitivity: 1.8mV/g
• Output Type: Analog
• Interface: Parallel
• Mounting Type: Surface Mount
• Package / Case: Surface Mount
• Voltage - Supply: -
• Bandwidth: -
• Other names: ACH-04-08-05; MSP1004

Accelerometer ACH-04-08-05
114-27002
plastic, paper, metal, etc. In fact, wind shields have been successfully integrated into the housing of the final circuit
board assembly negating the need for additional parts. While the shell does not have to be air-tight, tighter seals
provide better performance. Encapsulating the ACH-04-08-05 can also provide an effective wind shield. To ensure
that the ACH-04-08-05's housing is not compressed under the weight of the encapsulant, MSI recommends that a
spacer be placed above the unit. Note that the best performance is obtained by combining a wind shell with
encapsulation.
3.5 Base Strain Sensitivity
The ACH-04-08-05 displays Base Strain Sensitivity (BSS) for many of the same reasons that it displays TTS;
namely, low frequency operation and low modulus/high TCE materials. BSS is defined as the amount of output
signal generated as a result of bending in the accelerometer’s mounting surface and is expressed in terms of
equivalent g’s per input micro-strain, g/µ .
The best way to minimize BSS effects is to stiffen the mounting structure. Stiffer mounting structures are typically
less susceptible to bending. However, since the ACH-04-08-05 is designed to be attached to a circuit board, it may
be impractical to stiffen the mounting surface. In this situation, the accelerometer can be mounted at the end of a
“cantilever beam” routed into the circuit board, where minimal strain is coupled into the accelerometer. Mounting
arrangements such as this are very effective for low frequency applications. However, they are unacceptable for
high frequency measurements where the signal to be measured is near or above the resonant frequency of the
circuit board, cantilever beam. Implementation of a cantilever beam, strain minimization design requires careful
analysis to accurately position the cantilever resonance well above the frequency range of interest.
3.6 IC Package
To insure proper protection against RF and EM interference, the outer surface of the package is conductive and
electrically connected to the GND pin. Exercise caution when laying out PC boards to ensure that no uninsulated
traces are located under the package. They could contact the package surface and be shorted to GND. It is
recommended that all 14 pins of the package be soldered to the PC board to insure good mechanical coupling of
acceleration, motion, and shock. Complete soldering will also eliminate undesirable mechanical resonances of the
IC package.
Rev A
Measurement Specialties Incorporated, Norristown, PA 19403 610-650-1500
9 of 10
Printed in U.S.A. For drawings, technical data or samples, contact call 610-650-1500.
Specifications subject to change. Consult MSI for latest specifications.