OP27GZ Analog Devices Inc, OP27GZ Datasheet - Page 2

• Manufacturer Part Number: OP27GZ
• Description: Amplifier IC
• Manufacturer: Analog Devices Inc

Specifications of OP27GZ

• Peak Reflow Compatible (260 C): No
• Leaded Process Compatible: No
• Amplifier Type: General Purpose
• Number Of Circuits: 1
• Slew Rate: 2.8 V/µs
• Gain Bandwidth Product: 8MHz
• Current - Input Bias: 15nA
• Voltage - Input Offset: 30µV
• Voltage - Supply, Single/dual (±): ±4 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Current - Supply: -
• Output Type: -
• Current - Output / Channel: -
• -3db Bandwidth: -
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant, Contains lead / RoHS non-compliant

OP27
TABLE OF CONTENTS
Features .............................................................................................. 1
General Description ......................................................................... 1
Pin Configurations ........................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 4
Absolute Maximum Ratings............................................................ 7
REVISION HISTORY
5/06—Rev. E to Rev. F
Removed References to 745 ..............................................Universal
Updated 741 to AD741 ......................................................Universal
Changes to Ordering Guide .......................................................... 20
12/05—Rev. D to Rev. E
Edits to Figure 2 ................................................................................ 1
9/05—Rev. C to Rev. D
Updated Format..................................................................Universal
Changes to Table 1............................................................................ 4
Removed Die Characteristics Figure ............................................ 5
Removed Wafer Test Limits Table .................................................. 5
Changes to Table 5............................................................................ 7
Changes to Comments on Noise Section .................................... 15
Changes to Ordering Guide .......................................................... 24
1/03—Rev. B to Rev. C
Edits to Pin Connections................................................................. 1
Edits to General Description........................................................... 1
Edits to Die Characteristics............................................................. 5
Edits to Absolute Maximum Ratings ............................................. 7
Updated Outline Dimensions ....................................................... 16
Edits to Figure 8 .............................................................................. 14
Edits to Outline Dimensions......................................................... 16
Electrical Characteristics............................................................. 4
Typical Electrical Characteristics ............................................... 6
Thermal Resistance ...................................................................... 7
ESD Caution.................................................................................. 7
Rev. F | Page 2 of 20
Typical Performance Characteristics ..............................................8
Application Information................................................................ 14
Outline Dimensions ....................................................................... 19
Ordering Guide............................................................................... 20
9/01—Rev. 0 to Rev. A
Edits to Ordering Information ........................................................1
Edits to Pin Connections..................................................................1
Edits to Absolute Maximum Ratings ..............................................2
Edits to Package Type .......................................................................2
Edits to Electrical Characteristics .............................................. 2, 3
Edits to Wafer Test Limits ................................................................4
Deleted Typical Electrical Characteristics......................................4
Edits to Burn-In Circuit Figure .......................................................7
Edits to Application Information ....................................................8
Offset Voltage Adjustment ........................................................ 14
Noise Measurements.................................................................. 14
Unity-Gain Buffer Applications ............................................... 14
Comments On Noise ................................................................. 15
Audio Applications .................................................................... 16
References.................................................................................... 18