LM2904M National Semiconductor, LM2904M Datasheet - Page 2

IC, OP-AMP, 1MHZ, 0.1V/µs, SOIC-8

LM2904M

Manufacturer Part Number
LM2904M
Description
IC, OP-AMP, 1MHZ, 0.1V/µs, SOIC-8
Manufacturer
National Semiconductor
Type
General Purpose Amplifierr
Datasheet

Specifications of LM2904M

Op Amp Type
High Gain
No. Of Amplifiers
2
Bandwidth
1MHz
Slew Rate
0.1V/µs
Supply Voltage Range
± 1.5V To ± 16V
Amplifier Case Style
SOIC
No. Of Pins
8
Rail/rail I/o Type
No
Number Of Elements
2
Unity Gain Bandwidth Product
1MHz
Common Mode Rejection Ratio
50dB
Input Offset Voltage
7mV
Input Bias Current
250nA
Single Supply Voltage (typ)
5/9/12/15/18/24V
Dual Supply Voltage (typ)
±3/±5/±9/±12V
Power Dissipation
530mW
Voltage Gain In Db
100dB
Power Supply Rejection Ratio
50dB
Power Supply Requirement
Single/Dual
Shut Down Feature
No
Single Supply Voltage (min)
3V
Single Supply Voltage (max)
26V
Dual Supply Voltage (min)
±1.5V
Dual Supply Voltage (max)
±13V
Technology
Bipolar
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
8
Package Type
SOIC N
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

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Input Offset Voltage
Input Bias Current
Input Offset Current
Input Common-Mode
Voltage Range
Supply Current
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Electrical Characteristics
V
Supply Voltage, V
Differential Input Voltage
Input Voltage
Power Dissipation (Note 1)
Output Short-Circuit to GND
Input Current (V
Operating Temperature Range
Storage Temperature Range
Lead Temperature, DIP
Lead Temperature, Metal Can
Soldering Information
ESD Tolerance (Note 10)
+
Molded DIP
Metal Can
Small Outline Package (M)
micro SMD
(One Amplifier) (Note 2)
V
LM358
LM258
LM158
(Soldering, 10 seconds)
(Soldering, 10 seconds)
Dual-In-Line Package
Small Outline Package
See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering
surface mount devices.
= +5.0V, unless otherwise stated
+
Parameter
Soldering (10 seconds)
Vapor Phase (60 seconds)
Infrared (15 seconds)
≤ 15V and T
IN
+
A
<
= 25˚C
−0.3V) (Note 3)
(Note 5), T
I
V
I
V
(LM2904, V
Over Full Temperature Range
R
V
V
IN(+)
IN(+)
CM
+
+
+
L
= 30V, (Note 7)
= 30V (LM2904 V
= 5V
=
= 0V, (Note 6)
or I
− I
IN(−)
on All Op Amps
IN(−)
A
+
, V
, T
= 25˚C
Conditions
= 26V), T
CM
A
= 25˚C,
= 0V, T
+
A
= 26V)
(Note 9)
= 25˚C
A
= 25˚C
2
Min Typ
0
Distributors for availability and specifications.
LM158A/LM258A/LM358A
LM158A
LM158/LM258/LM358
0.5
20
1
2
1
−55˚C to +125˚C
−65˚C to +150˚C
−25˚C to +85˚C
−0.3V to +32V
0˚C to +70˚C
V
Continuous
+
Max
830 mW
550 mW
530 mW
1.2
50
10
435mW
−1.5
50 mA
2
2
260˚C
300˚C
260˚C
215˚C
220˚C
250V
32V
32V
Min Typ
0
LM358A
0.5
45
2
5
1
V
+
Max
100
1.2
30
−1.5
3
2
Min Typ
LM158/LM258
0
−65˚C to +150˚C
−40˚C to +85˚C
−0.3V to +26V
0.5
45
2
3
1
Continuous
830 mW
530 mW
LM2904
50 mA
260˚C
300˚C
260˚C
215˚C
220˚C
250V
V
26V
26V
+
Max
150
1.2
30
−1.5
5
2
Units
mV
mA
mA
nA
nA
V

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