XC9536-15VQG44C Xilinx Inc, XC9536-15VQG44C Datasheet
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XC9536-15VQG44C
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XC9536-15VQG44C Summary of contents
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... UMC or He Jian until the UMC material is depleted. Products Affected This change affects all speed, package, and temperature variations of the commercial and industrial grade XC95288XL and XC9536XL devices. Q grade devices are not affected by this PCN. Affected part numbers are included in the following lists: XC95288XL-10BG256C XC95288XL-10BG256I ...
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... XC95288XL-10TQ144C0962). The ordering code 0962 will not be marked on the package topmark. Upon availability of production units from He Jian of the XC95288XL and the XC9536XL devices on January 2, 2006, cus- tomers can expect to receive devices fabricated by either UMC or He Jian until the UMC material is depleted. The last time buy (LTB) date for product specifically fabricated at UMC in Taiwan is June 26, 2006, with shipment requested before December 29, 2006 (Last Time Ship - LTS) ...
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... Table 3: Process Reliability Data: 0.35mm He Jian Process Reliability Data (Wafer Level Reliability Data) Mechanism Sample Size HCI 3 lots, 20 units/lot TDDB 3 lots, 20 units/lot EM 3 lots, 20 units/lot XCN05015 (v1.0) October 3, 2005 Change in Wafer Fabrication Facility for XC95288XL and XC9536XL CPLDs Test conditions Device XC95288XL HBM JESD22-A-114 XC9536XL XC95288XL JESD78 XC9536XL Condition of ...
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... For instructions on how to sign up, refer to Revision History The following table shows the revision history for this document. Date Version 10/03/05 1.0 XCN05015 (v1.0) October 3, 2005 Change in Wafer Fabrication Facility for XC95288XL and XC9536XL CPLDs Xilinx Answer Record 18683. Initial release. www.xilinx.com Xilinx Technical Support. Revision 4 ...