74LVC1G14GW NXP Semiconductors, 74LVC1G14GW Datasheet
74LVC1G14GW
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74LVC1G14GW Summary of contents
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Single Schmitt-trigger inverter Rev. 07 — 18 July 2007 1. General description The 74LVC1G14 provides the inverting buffer function with Schmitt-trigger action. The input can be driven from either 3 devices. This feature allows the ...
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... Type number Package Temperature range Name 74LVC1G14GW +125 C 74LVC1G14GV +125 C 74LVC1G14GM +125 C 74LVC1G14GF +125 C 5. Marking Table 2. Marking Type number 74LVC1G14GW 74LVC1G14GV 74LVC1G14GM 74LVC1G14GF 6. Functional diagram mna023 Fig 1. Logic symbol 74LVC1G14_7 Product data sheet Description TSSOP5 plastic thin shrink small outline package; 5 leads; ...
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... NXP Semiconductors 7. Pinning information 7.1 Pinning 74LVC1G14 n. GND Y 001aab655 Fig 4. Pin configuration SOT353-1 and SOT753 7.2 Pin description Table 3. Pin description Symbol Pin SOT353-1/SOT753 n. GND n. Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level 74LVC1G14_7 Product data sheet 74LVC1G14 n ...
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... NXP Semiconductors 9. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC V input voltage I V output voltage O I input clamping current IK I output clamping current OK I output current ...
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... NXP Semiconductors 11. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions V HIGH-level output voltage I = 100 LOW-level output voltage I = 100 input leakage GND current 5 power-off OFF I leakage current I supply current GND ...
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... NXP Semiconductors Table 8. Transfer characteristics Voltages are referenced to GND (ground = 0 V); for load circuit see Symbol Parameter Conditions V negative-going see T threshold voltage V hysteresis voltage (V H Figure 10 [1] All typical values are measured at T 12. Dynamic characteristics Table 9. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for load circuit see ...
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... NXP Semiconductors 13. Waveforms Measurement points are given in V and V are typical output voltage levels that occur with the output load Fig 7. The data input (A) to output (Y) propagation delays Table 10. Measurement points Supply voltage 1. 2.7 V 2 3 5.5 V ...
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... NXP Semiconductors Table 11. Test data Supply voltage Input 2.7 V 2 3.6 V 2 14. Waveforms transfer characteristics Fig 9. Transfer characteristic Fig 11. Typical transfer characteristics 74LVC1G14_7 Product data sheet Load mna207 Fig 10. Definition (mA Rev. 07 — 18 July 2007 ...
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... NXP Semiconductors 15. Application information The slow input rise and fall times cause additional power dissipation, this can be calculated using the following formula add additional power dissipation ( W); add f = input frequency (MHz input rise time (ns input fall time (ns CC(AV) Average I An example of a relaxation circuit using the 74LVC1G14 is shown in ...
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... NXP Semiconductors 16. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION IEC SOT353-1 Fig 14 ...
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... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions UNIT 0.100 0.40 1.1 0.26 mm 0.013 0.25 0.9 0.10 OUTLINE VERSION IEC SOT753 Fig 15. Package outline SOT753 (SC-74A) 74LVC1G14_7 Product data sheet scale 3.1 1.7 3.0 0.6 0.95 2.7 1.3 2 ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1. (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 1.5 mm 0.5 0.04 0.17 1.4 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 0 (1) terminal 1 index area DIMENSIONS (mm are the original dimensions UNIT b D max max 0.20 1.05 mm 0.5 0.04 0.12 0.95 Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION IEC SOT891 Fig 17 ...
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... Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section 11 “Static Changed: Conditions for input leakage current and supply current. ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Functional description . . . . . . . . . . . . . . . . . . . 3 9 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 13 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 14 Waveforms transfer characteristics ...