IS42S32800D-7TLI INTEGRATED SILICON SOLUTION (ISSI), IS42S32800D-7TLI Datasheet - Page 28
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IS42S32800D-7TLI
Manufacturer Part Number
IS42S32800D-7TLI
Description
SDRAM, IND, 8M X 32, 3V, 86TSOP2
Manufacturer
INTEGRATED SILICON SOLUTION (ISSI)
Datasheet
1.IS42S32800D-7TL.pdf
(62 pages)
Specifications of IS42S32800D-7TLI
Access Time
5.5ns
Page Size
256Mbit
Memory Case Style
TSOP-2
No. Of Pins
86
Operating Temperature Range
-40°C To +85°C
Memory Type
DRAM - Synchronous
Memory Configuration
4 BLK (2M X 32)
Interface Type
LVTTL
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IS42S32800D-7TLI
Manufacturer:
ISSI
Quantity:
20 000
IS42S32800D
28
Figure 5.Self Refresh Entry &Exit Cycle
BS0,1
A0-A9
DQM
RAS#
CAS#
WE#
CLK
CKE
CS#
Note:To Enter SelfRefresh Mode
1. CS#,RAS#&CAS#with CKE should be low at the same clock cycle.
2. After 1 clock cycle,all the inputs including the system clock can be don ’t care except for CKE.
3. The device remains in SelfRefresh mode as long as CKE stays “low”.
To Exit SelfRefresh Mode
1. System clock restart and be stable before returning CKE high.
2. Enable CKE and CKE should be set high for minimum time of tSRX.
3. CS#starts from high.
4. Minimum tRC is required after CKE going high to complete SelfRefresh exit.
5. 2048 cycles of burst AutoRefresh is required before SelfRefresh entry and after SelfRefresh exit if the system uses burst refresh.
DQ
Once the device enters SelfRefresh mode,minimum tRAS is required before exit from SelfRefresh.
T0
*Note 8
SelfRefresh Enter
*Note 1
T1
t
IS
Hi-Z
T2
*Note 2
T3
T4
T5
T6
*Note 3
T7
T8
T9
T10
Hi-Z
Integrated Silicon Solution, Inc. — www.issi.com
*Note 4
SelfRefresh Exit
T11
*Note 5
t
*Note 6
SRX
T12
t
RC(min) *Note 7
T13
T14
Auto Refresh
T15
*Note 8
t
T16
PDE
T17
T18
T19
Rev. 00B
11/21/07