S29GL256P11FFI010 Spansion Inc., S29GL256P11FFI010 Datasheet - Page 61

• Manufacturer Part Number: S29GL256P11FFI010
• Description: IC, FLASH, 256MBIT, 110NS, BGA-64
• Manufacturer: Spansion Inc.

Specifications of S29GL256P11FFI010

• Memory Type: Flash
• Memory Size: 256Mbit
• Memory Configuration: 128K X 16
• Ic Interface Type: Parallel
• Access Time: 110ns
• Supply Voltage Range: 2.7V To 3.6V
• Memory Case Style: BGA
• No. Of Pins: 64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Notes
1.
2. PA = program address, SA = sector address, PD = program data.
3. DQ7# is the complement of the data written to the device. D
4. Waveforms are for the word mode.
November 21, 2006 S29GL-P_00_A3
Figure 11.15
Addresses
RESET#
RY/BY#
indicates last two bus cycles of a program or erase operation.
WE#
Data
OE#
CE#
D a t a
t
RH
555 for program
2AA for erase
Figure 11.15 Alternate CE# Controlled Write (Erase/Program) Operation Timings
S h e e t
t
t
t
WS
WH
WC
A0 for program
55 for erase
t
GHEL
( A d v a n c e
t
t
t
DS
CP
PA for program
SA for sector erase
555 for chip erase
CPH
t
AS
t
S29GL-P MirrorBit
DH
OUT
is the data written to the device.
t
AH
PD for program
30 for sector erase
10 for chip erase
t
BUSY
I n f o r m a t i o n )
TM
t
WHWH1 or 2
Flash Family
Data# Polling
DQ7#
PA
D
OUT
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