AM29F010B-70EF Spansion Inc., AM29F010B-70EF Datasheet - Page 33
![IC, FLASH, 1MBIT, 70NS, TSOP-32](/photos/19/5/190556/4434964_sml.jpg)
AM29F010B-70EF
Manufacturer Part Number
AM29F010B-70EF
Description
IC, FLASH, 1MBIT, 70NS, TSOP-32
Manufacturer
Spansion Inc.
Specifications of AM29F010B-70EF
Memory Type
Flash
Memory Size
1Mbit
Memory Configuration
128K X 8
Access Time
70ns
Supply Voltage Range
4.5V To 5.5V
Memory Case Style
TSOP
No. Of Pins
32
Cell Type
NOR
Density
1Mb
Access Time (max)
70ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
17b
Operating Supply Voltage (typ)
5V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Program/erase Volt (typ)
4.5 to 5.5V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
4.5V
Operating Supply Voltage (max)
5.5V
Word Size
8b
Number Of Words
128K
Supply Current
30mA
Mounting
Surface Mount
Pin Count
32
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AM29F010B-70EF
Manufacturer:
AMD
Quantity:
20 000
D A T A
S H E E T
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-
tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-
templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion Inc. will not be liable
to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating
conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign
Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-
thorization by the respective government entity will be required for export of those products
Trademarks
Copyright ©1997-2006 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trade-
marks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are
for identification purposes only and may be trademarks of their respective companies.
®
®
®
Copyright ©2006-2009 Spansion Inc. All rights reserved. Spansion
, the Spansion logo, MirrorBit
, MirrorBit
Eclipse™, ORNAND™, Eco-
RAM™ and combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other
names used are for informational purposes only and may be trademarks of their respective owners.
November 12, 2009 Am29F010B_00_C10
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