LM117H National Semiconductor, LM117H Datasheet - Page 11
![IC, ADJ LINEAR REG, 1.2V TO 37V, TO-39-3](/photos/37/12/371225/to-39_sml.jpg)
LM117H
Manufacturer Part Number
LM117H
Description
IC, ADJ LINEAR REG, 1.2V TO 37V, TO-39-3
Manufacturer
National Semiconductor
Datasheet
1.LM117H.pdf
(28 pages)
Specifications of LM117H
Primary Input Voltage
40V
Dropout Voltage Vdo
2.2V
No. Of Outputs
1
No. Of Pins
3
Output Current
500mA
Operating Temperature Range
0°C To +125°C
Voltage Regulator Type
Linear
Topology
Standard
Regulator Output Type
Adjustable
Polarity Type
Positive
Number Of Outputs
Single
Input Voltage (min)
4.2V
Input Voltage (max)
40V
Output Voltage
1.2 to 37V
Package Type
TO-39
Load Regulation
0.3%
Line Regulation
0.02%/V
Operating Temp Range
-55C to 150C
Operating Temperature Classification
Military
Pin Count
3
Mounting
Through Hole
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LM117H
Manufacturer:
NS/国半
Quantity:
20 000
Company:
Part Number:
LM117H/883Q
Manufacturer:
AOS
Quantity:
125
Part Number:
LM117HRQMLV
Manufacturer:
NS/国半
Quantity:
20 000
Part Number:
LM117HVI
Manufacturer:
LINEAR/凌特
Quantity:
20 000
HEATSINKING THE TO-263 PACKAGE
Figure 7
−A)
ounce copper and no solder mask over the copper area used
for heatsinking.
As shown in
square inch produces very little improvement. It should also
be observed that the minimum value of θ
package mounted to a PCB is 32°C/W.
FIGURE 6. Maximum Power Dissipation vs T
for different copper area sizes using a typical PCB with 1
FIGURE 5. θ
shows for the TO-263 the measured values of θ
Figure
(J−A)
7, increasing the copper area beyond 1
SOT-223 Package
SOT-223 Package
vs Copper (2 ounce) Area for the
(J−A)
for the TO-263
906357
906358
AMB
for the
(J
11
FIGURE 7. θ
As a design aid,
er dissipation compared to ambient temperature for the
TO-263 device (assuming θ
junction temperature is 125°C).
HEATSINKING THE TO-252 PACKAGE
If the maximum allowable value for θ
C/W (Typical Rated Value) for TO-252 package, no heatsink
is needed since the package alone will dissipate enough heat
to satisfy these requirements. If the calculated value for θ
falls below these limits, a heatsink is required.
As a design aid,
for different heatsink area. The copper patterns that we used
to measure these θ
Notes Section.
are in
Figure 10
vs. ambient temperature for the TO-252 device.
shows the maximum allowable power dissipation vs. copper
area (in
thermal enhancement techniques to be used with SOT-223
and TO-252 packages.
FIGURE 8. Maximum Power Dissipation vs T
Table
2
) for the TO-252 device. Please see AN-1028 for
shows the maximum allowable power dissipation
1.
(J−A)
Figure 9
Figure 8
Table 1
vs Copper (1 ounce) Area for the TO-263
JA
s are shown at the end of the Application
TO-263 Package
reflects the same test results as what
shows the value of the θ
shows the maximum allowable pow-
Package
(J−A)
is 35°C/W and the maximum
JA
is found to be
906355
JA
AMB
906356
www.national.com
of TO-252
Figure 11
for the
≥
103°
JA