LM317AMDT National Semiconductor, LM317AMDT Datasheet - Page 5

• Manufacturer Part Number: LM317AMDT
• Description: IC, ADJ LINEAR REG, 1.2V TO 37V, TO252-3
• Manufacturer: National Semiconductor

Specifications of LM317AMDT

• Primary Input Voltage: 40V
• Dropout Voltage Vdo: 2V
• No. Of Outputs: 1
• No. Of Pins: 3
• Output Current: 500mA
• Operating Temperature Range: -40°C To +125°C
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Reference Voltage
Line Regulation
Load Regulation
Thermal Regulation
Adjustment Pin Current
Adjustment Pin Current
Change
Temperature Stability
Minimum Load Current
Current Limit
RMS Output Noise, % of V
Ripple Rejection Ratio
Long-Term Stability
Thermal Resistance,
Junction-to-Case
Thermal Resistance,
Junction-to-Ambient (No Heat
Sink)
Electrical Characteristics
Specifications with standard type face are for T
ture Range. Unless otherwise specified, V
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The
guaranteed specifications apply only for the test conditions listed.
Note 2: Refer to RETS117H drawing for the LM117H, or the RETS117K for the LM117K military specifications.
Note 3: Although power dissipation is internally limited, these specifications are applicable for maximum power dissipations of 2W for the TO-39 and SOT-223 and
20W for the TO-3, TO-220, and TO-263. I
All limits (i.e., the numbers in the Min. and Max. columns) are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 4: Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are
covered under the specifications for thermal regulation.
Note 5: Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Note 6: If the TO-263 or TO-252 packages are used, the thermal resistance can be reduced by increasing the PC board copper area thermally connected to the
package. Using 0.5 square inches of copper area. θ
area, θ
heatsinking).
JA
is 32˚C/W. If the SOT-223 package is used, the thermal resistance can be reduced by increasing the PC board copper area (see applications hints for
Parameter
OUT
MAX
3V ≤ (V
10 mA ≤ I
3V ≤ (V
10 mA ≤ I
20 ms Pulse
10 mA ≤ I
3V ≤ (V
T
(V
(V
(V
10 Hz ≤ f ≤ 10 kHz
V
C
V
C
T
K Package
MDT Package
H Package
T Package
MP Package
K Package
MDT Package(Note 6)
H Package
T Package
S Package (Note 6)
MIN
OUT
OUT
J
ADJ
ADJ
IN
IN
K, T, S Packages
H Package
MP Package
IN
K, T, S Packages
H Package
MP Package
is 1.5A for the TO-3, TO-220, and TO-263 packages, 0.5A for the TO-39 package and 1A for the SOT-223 Package.
= 125˚C, 1000 hrs
− V
− V
− V
≤ T
= 0 µF
= 10 µF
= 10V, f = 120 Hz,
= 10V, f = 120 Hz,
JA
IN
IN
IN
OUT
OUT
OUT
J
IN
is 50˚C/W; with 1 square inch of copper area, θ
(Note 3)
OUT
OUT
OUT
− V
− V
− V
≤ T
− V
) = 40V
) ≤ 15V
) = 40V
Conditions
OUT
OUT
OUT
MAX
J
≤ I
≤ I
≤ I
OUT
= 25˚C, and those with boldface type apply over full Operating Tempera-
MAX
MAX
MAX
) ≤ 40V,
) ≤ 40V (Note 4)
) ≤ 40V
= 5V, and I
, P ≤ P
(Note 4)
MAX
5
OUT
= 10 mA.
1.238
1.225
0.075
0.15
0.15
Min
1.5
0.5
1.5
66
LM317A
JA
1.250
1.250
0.005
0.003
0.01
0.04
23.5
Typ
140
0.1
0.3
0.2
3.5
2.2
0.8
2.2
0.4
0.2
0.4
0.3
50
65
80
12
35
50
50
is 37˚C/W; and with 1.6 or more square inches of copper
1
4
1.262
1.270
Max
0.01
0.02
0.07
100
0.5
3.4
1.8
3.4
10
15
1
5
1
5
0.075
1.20
0.15
0.15
Min
1.5
0.5
1.5
66
LM317
0.003
1.25
0.01
0.02
0.04
23.5
Typ
140
0.1
0.3
0.2
3.5
2.2
0.8
2.2
0.4
0.2
0.4
0.3
2.3
50
65
80
12
35
92
50
50
1
5
4
Max
1.30
0.04
0.07
0.07
100
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0.5
1.5
3.4
1.8
3.4
10
15
5
1
3
Units
˚C/W
˚C/W
˚C/W
˚C/W
˚C/W
˚C/W
˚C/W
˚C/W
˚C/W
˚C/W
%/W
%/V
%/V
mA
µA
µA
dB
dB
%
%
%
%
%
V
V
A
A
A
A
A
A