ADG608BNZ Analog Devices Inc, ADG608BNZ Datasheet - Page 5

• Manufacturer Part Number: ADG608BNZ
• Description: 5V/3V 8CH/4 DIFF.CH MUX. I.C.
• Manufacturer: Analog Devices Inc
• Type: Analog Multiplexerr

Specifications of ADG608BNZ

• Rohs Compliant: YES
• Function: Multiplexer
• Circuit: 1 x 8:1
• On-state Resistance: 30 Ohm
• Voltage Supply Source: Single Supply
• Voltage - Supply, Single/dual (±): 3V, 5V
• Current - Supply: .05µA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Package: 16PDIP
• Maximum On Resistance: 90@3V Ohm
• Maximum Propagation Delay Bus To Bus: 75@±5V|100@5V|170@3.3V ns
• Maximum High Level Output Current: 20 mA
• Multiplexer Architecture: 8:1
• Maximum Turn-off Time: 60@3.3V ns
• Maximum Turn-on Time: 170@3.3V ns
• Power Supply Type: Single|Dual
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

REV. A
ABSOLUTE MAXIMUM RATINGS
(T
V
V
V
Analog, Digital Inputs
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 20 mA
Peak Current, S or D
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . –65 C to +150 C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150 C
Plastic DIP Package
DD
DD
SS
A
(Pulsed at 1 ms, 10% Duty Cycle Max) . . . . . . . . . . 40 mA
Industrial (B Version) . . . . . . . . . . . . . . . . –40 C to +85 C
Extended (T Version) . . . . . . . . . . . . . . . – 55 C to +125 C
Lead Temperature, Soldering (10 sec) . . . . . . . . . . +260 C
JA
= +25 C unless otherwise noted)
to GND . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –6.5 V
to V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6.5 V
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 117 C/W
SS
A2
X
0
0
0
0
1
1
1
1
X = Don’t Care
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +13 V
Table I. ADG608 Truth Table
A1
X
0
0
1
1
0
0
1
1
V
EN
A0
S1
S2
S3
S4
SS
D
2
DIP/SOIC/TSSOP
1
2
3
4
5
6
7
8
. . . . . . . . . . . . . . –0.3 V to V
(Not to Scale)
A0
X
0
1
0
1
0
1
0
1
ADG608
TOP VIEW
or 20 mA, Whichever Occurs First
EN
0
1
1
1
1
1
1
1
1
16
15
14
13
12
10
1
11
9
A1
A2
GND
V
S5
S6
S7
S8
DD
ON SWITCH
NONE
1
2
3
4
5
6
7
8
PIN CONFIGURATIONS
DD
+ 2 V
–5–
SOIC Package
TSSOP Package
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >5000 V
NOTES
1
2
Stresses above those listed under “Absolute Maximum Ratings” may cause
Overvoltages at A, S, D or EN will be clamped by internal diodes. Current should
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those listed in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Only one absolute maximum rating may be applied at any one time.
be limited to the maximum ratings given.
Lead Temperature, Soldering
Lead Temperature, Soldering
JA
JA
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 C
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 77 C/W
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 158 C/W
X = Don’t Care
A1
X
0
0
1
1
Table II. ADG609 Truth Table
A0
X
0
1
0
1
S1A
S2A
S3A
S4A
V
EN
DA
A0
SS
DIP/SOIC/TSSOP
1
2
3
4
5
6
7
8
(Not to Scale)
EN
0
1
1
1
1
ADG609
TOP VIEW
ADG608/ADG609
ON SWITCH PAIR
NONE
1
2
3
4
16
15
14
13
12
10
11
9
A1
GND
V
S1B
S2B
S3B
S4B
DB
DD