ADA4851-1YRJZ Analog Devices Inc, ADA4851-1YRJZ Datasheet - Page 6

• Manufacturer Part Number: ADA4851-1YRJZ
• Description: OP AMP, HIGH SPEED RRO/P, SMD, 4851
• Manufacturer: Analog Devices Inc

Specifications of ADA4851-1YRJZ

• Op Amp Type: High Speed
• No. Of Amplifiers: 1
• Bandwidth: 130MHz
• Slew Rate: 375V/µs
• Supply Voltage Range: 2.7V To 12V
• Amplifier Case Style: SOT-23
• No. Of Pins: 6
• Operating Temperature Range: -40°C To
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADA4851-1/ADA4851-4
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Power Dissipation
Common-Mode Input Voltage
Differential Input Voltage
Storage Temperature
Operating Temperature Range
Lead Temperature Range
(Soldering 10 sec)
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
for device soldered in circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type
6-Lead SOT-23
14-Lead TSSOP
Maximum Power Dissipation
The maximum safe power dissipation for the ADA4851-1/
ADA4851-4 is limited by the associated rise in junction
temperature (T
the glass transition temperature, the plastic changes its
properties. Even temporarily exceeding this temperature limit
may change the stresses that the package exerts on the die,
permanently shifting the parametric performance of the
ADA4851-1/ADA4851-4. Exceeding a junction temperature of
150°C for an extended period of time can result in changes in
silicon devices, potentially causing degradation or loss of
functionality.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
JA
is specified for the worst-case conditions, i.e., θ
J
) on the die. At approximately 150°C, which is
Rating
12.6 V
See Figure 4
−V
+V
−65°C to +125°C
−40°C to +125°C
300°C
150°C
θ
170
120
JA
S
S
− 0.5 V to +V
to −V
S
JA
Unit
°C/W
°C/W
is specified
S
+ 0.5 V
Rev. A | Page 6 of 16
The power dissipated in the package (P
quiescent power dissipation and the power dissipated in the die
due to the ADA4851-1/ADA4851-4 drive at the output. The
quiescent power is the voltage between the supply pins (V
times the quiescent current (I
RMS output voltages should be considered. If R
to −V
V
worst case, when V
In single-supply operation with R
is V
Airflow increases heat dissipation, effectively reducing θ
Also, more metal directly in contact with the package leads and
exposed paddle from metal traces, through holes, ground, and
power planes, reduces θ
Figure 4 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 6-lead SOT-23
(170°C/W) package and the 14-lead TSSOP (120°C/W) on a
JEDEC standard 4-layer board. θ
Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
S
× I
OUT
P
P
P
S
OUT
D
D
, as in single-supply operation, the total drive power is
D
= V
2.0
1.5
1.0
0.5
= Quiescent Power + (Total Drive Power − Load Power)
=
=
. If the rms signal levels are indeterminate, consider the
0
–40
(
(
V
V
S
/2.
–30 –20 –10 0
S
S
×
×
I
I
S
S
)
)
+
+
OUT
⎛
⎜
⎝
(
V
V
= V
2
S
R
AMBIENT TEMPERATURE (°C)
S
JA
4 /
10 20
L
.
×
S
)
V
/4 for R
2
SOT-23
R
OUT
S
L
30
).
TSSOP
⎞
⎟
⎠
JA
40
L
–
L
referenced to −V
values are approximations.
V
to midsupply.
50 60 70
OUT
R
L
D
) is the sum of the
2
80
L
90
is referenced
100
S
, worst case
110
120
JA
.
S
)