LP8900TLX-3333 National Semiconductor, LP8900TLX-3333 Datasheet - Page 10

• Manufacturer Part Number: LP8900TLX-3333
• Description: REG ULN, DUAL, 200MA, 6-MICROSMD
• Manufacturer: National Semiconductor

Specifications of LP8900TLX-3333

• Primary Input Voltage: 3.8V
• Output Voltage: 3.6V
• Dropout Voltage Vdo: 110mV
• No. Of Pins: 6
• Output Current: 200mA
• Operating Temperature Range: -40°C To +125°C
• Svhc: No SVHC (15-Dec-2010)
• Operating: RoHS Compliant
• Output Voltage Fixed: 3.6V
• Voltage Regulator Case Style: Micro SMD
• Rohs Compliant: Yes

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range, it would have to be larger in capacitance (which means
bigger and more costly) than a ceramic capacitor with the
same ESR value. It should also be noted that the ESR of a
typical tantalum will increase about 2:1 as the temperature
goes from 25°C down to -40°C, so some guard band must be
allowed.
ENABLE CONTROL
The LP8900 may be switched ON or OFF by a logic input at
the ENABLE pin.A high voltage at this pin will turn the device
on. When the enable pin is low, the regulator output is off and
the device typically consumes 3nA. However if the application
does not require the shutdown feature, the V
to V
start-up is achieved, V
A 3MΩ pulldown resister ties the V
sures that the device will remain off when the enable pin is
left open circuit. To ensure proper operation, the signal source
used to drive the V
below the specified turn-on/off voltage thresholds listed in the
Electrical Characteristics section under V
IN
to keep the regulator permanantly on. To ensure fast
EN
input must be able to swing above and
EN
should be driven separately.
EN
input to ground, this en-
IL
and V
EN
pin can be tied
IH
.
10
micro SMD MOUNTING
The micro SMD package requires specific mounting tech-
niques which are detailed in the National Semiconductor
Application Note (AN-1112). Referring to the section Surface
Mount Technology (SMT) Assenbly Considerations, it should
be noted that the pad style which must be used with the 6 pin
package is NSMD (non-solder mask defined) type.
For best results during assembly, alignment ordinals on the
PCB may be used to facilitate placement of the micro SMD
device.
micro SMD LIGHT SENSITIVITY
Exposing the micro SMD device to direct sunlight may cause
mis-operation of the device. Light sources such as halogen
lamps can affect the electrical performance if brought near to
the device.
The wavelengths which have most detrimental effect are reds
and infra-reds, which means that fluorescent lighting, used
inside most buildings will have little effect on performance.