DSPIC30F1010-30I/MM Microchip Technology, DSPIC30F1010-30I/MM Datasheet - Page 250

• Manufacturer Part Number: DSPIC30F1010-30I/MM
• Description: 6KB, Flash, 256bytes-RAM, 30MIPS, 21I/O, 16-bit Family,nanoWatt 28 QFN-S 6x6mm T
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F1010-30I/MM

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 21
• Program Memory Size: 6KB (2K x 24)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-QFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300023 - KIT DEMO DSPICDEM SMPS BUCKDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

dsPIC30F1010/202X
FIGURE 21-5:
TABLE 21-19: BAND GAP START-UP TIME REQUIREMENTS
DS70178C-page 248
AC CHARACTERISTICS
SY40
Note 1:
Param
(see Note)
Enable Band Gap
No.
2:
T
Symbol
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
BGAP
0V
Band Gap Start-up Time
BAND GAP START-UP TIME CHARACTERISTICS
Characteristic
(1)
SY40
Standard Operating Conditions: 3.3V and 5.0V (±10%)
(unless otherwise stated)
Operating temperature
Min
—
Preliminary
Typ
40
(2)
Max
65
Units
-40°C
-40°C
µs
Defined as the time between the
instant that the band gap is enabled
and the moment that the band gap
reference voltage is stable.
RCON<13> status bit.
T
T
A
A
+85°C for Industrial
+125°C for Extended
© 2006 Microchip Technology Inc.
Conditions
V
BGAP
Band Gap
Stable