DSPIC30F6011A-20E/PT Microchip Technology, DSPIC30F6011A-20E/PT Datasheet - Page 4
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DSPIC30F6011A-20E/PT
Manufacturer Part Number
DSPIC30F6011A-20E/PT
Description
Digital Signal Processor
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2011-20IP.pdf
(26 pages)
3.DSPIC30F5011-20IPT.pdf
(220 pages)
4.DSPIC30F6011A-30IPT.pdf
(234 pages)
5.DSPIC30F6011A-30IPT.pdf
(8 pages)
6.DSPIC30F6011A-30IPT.pdf
(10 pages)
7.DSPIC30F6011A-30IPT.pdf
(6 pages)
8.DSPIC30F6011A-30IPT.pdf
(8 pages)
9.DSPIC30F6011A-30IPT.pdf
(16 pages)
Specifications of DSPIC30F6011A-20E/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
52
Program Memory Size
132KB (44K x 24)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
6K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-TFQFP
Package
64TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
20 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
52
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
16-chx12-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC30F008 - MODULE SKT FOR DSPIC30F 64TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6011A-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6011A-20E/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
dsPIC30F6011A/6012A/6013A/6014A
Silicon Errata Issues
1. Module: CPU
EXAMPLE 1:
DS80457B-page 4
L0:daw.b
L1: ....
Note:
The Decimal Adjust instruction, DAW.b, may
improperly clear the Carry bit, C (SR<0>), when
executed.
Work around
Check the state of the Carry bit prior to executing
the DAW.b instruction. If the Carry bit is set, set the
Carry bit again after executing the DAW.b
instruction. Example 1 shows how the application
should process the Carry bit during a BCD addition
operation.
Affected Silicon Revisions
.include “p30fxxxx.inc”
.......
mov.b
mov.b
add.b
bra
daw.b
bset.b
bra
A2
X
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated by the shaded column in
the following tables apply to the current
silicon revision (B1).
B0
X
#0x80, w0
#0x80, w1
w0, w1, w2 ;Perform addition
NC, L0
w2
L1
w2
SR, #C
B1
X
CHECK CARRY BIT BEFORE
DAW.b
;First BCD number
;Second BCD number
;If C set go to L0
;If not,do DAW and
;set the carry bit
;and exit
2. Module: Output Compare
If the desired duty cycle is ‘0’ (OCxRS = 0), the
module will generate a high level glitch of 1 T
Additionally, on the next cycle after the glitch, the
OC pin does not go high, or, in other words, it
misses the next compare for any value written on
OCxRS.
Work around
There are two possible solutions to this problem:
1. Load a value greater than ‘0’ to the OCxRS
2. If the application requires 0% duty cycles, the
Affected Silicon Revisions
A2
X
register when operating in PWM mode. In this
case, no 0% duty cycle is achievable.
output compare module can be disabled for
0% duty cycles, and re-enabled for non-zero
percent duty cycles.
B0
X
B1
X
© 2010 Microchip Technology Inc.
CY
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