HCS365/P Microchip Technology, HCS365/P Datasheet - Page 23
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
HCS365/P
Manufacturer Part Number
HCS365/P
Description
IC,Remote-Control Transmitter/Encoder,CMOS,DIP,8PIN
Manufacturer
Microchip Technology
Type
Code Hopping Encoderr
Specifications of HCS365/P
Applications
Remote Secure Access, Keyless Entry
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCS365/P
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
HCS365/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
9.0
9.1
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on V
Voltage on LED w/respect to V
Voltage on all other pins w/respect to V
Total power dissipation (Note 1) ..........................................................................................................................500 mW
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any Output pin....................................................................................................25 mA
Maximum output current sourced by any Output pin ..............................................................................................25 mA
*Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at those or any other conditions above those indicated in the
operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Note 1: Power dissipation is calculated as follows: Pdis=V
2002 Microchip Technology Inc.
ELECTRICAL CHARACTERISTICS
Maximum Ratings*
DD
w/respect to V
IK
OK
(V
DD
SS
I
(Vo < 0 or Vo >V
< 0 or V
pin ..............................................................................................................................100 mA
pin ...........................................................................................................................100 mA
SS
SS
................................................................................................................ -0.3 to +7.5V
..................................................................................................................-0.3 to +11V
I
> V
SS
DD
) ......................................................................................................... ± 20 mA
........................................................................................-0.3V to V
DD
).................................................................................................... ± 20 mA
Preliminary
DD
x {I
DD
- Â I
OH
} + Â {(V
DD
-V
OH
) x I
HCS365
OH
DS41109D-page 23
} + Â(V
O
DD
l x I
+ 0.3V
OL
).