PIC12F510T-I/MC Microchip Technology, PIC12F510T-I/MC Datasheet - Page 6
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC12F510T-I/MC
Manufacturer Part Number
PIC12F510T-I/MC
Description
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,LLCC,8PIN,PLASTIC
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F510-ISN.pdf
(124 pages)
2.PIC12F510-ISN.pdf
(8 pages)
3.PIC12F510-ISN.pdf
(20 pages)
Specifications of PIC12F510T-I/MC
Rohs Compliant
YES
Core Processor
PIC
Core Size
8-Bit
Speed
8MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Size
1.5KB (1K x 12)
Program Memory Type
FLASH
Ram Size
38 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DFN
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
38 B
Interface Type
USB
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
6
Number Of Timers
1
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164101, DV164120, DM163029
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit, 3 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164334 - MODULE SOCKET FOR 8L 2X3MM DFNAC163022 - ADAPTER UNIVERSAL PROG PIC12F5XXAC162070 - HEADER INTRFC MPLAB ICD2 8/14PXLT08DFN2 - SOCKET TRANSITION ICE 14DIP/8DFN
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Details
PIC12F510
3.1.2.5
The End Programming command terminates the
program process. A delay of T
required before the next command to allow the internal
programming voltage to discharge (see Figure 3-6).
FIGURE 3-6:
3.1.2.6
After this command is performed, the entire program
memory and Configuration Word is erased.
To perform a Bulk Erase of the program memory and
configuration fuses, the following sequence must be
performed (see Figure 3-12).
1.
2.
3.
4.
5.
DS41257B-page 6
Note 1: A fully erased part will read ‘1’s in every
Read and save 0x3FF oscillator calibration bits
and 0x404 backup OSCCAL bits into computer/
programmer temporary memory.
Enter Program/Verify mode. PC is set to Config-
uration Word address.
Perform a Bulk Erase Program Memory
command.
Wait T
Restore OSCCAL bits.
2: The oscillator calibration bits are erased if
ICSPCLK
ICSPDAT
ERA
program memory location.
a Bulk Erase is invoked. They must be
read and saved prior to erasing the
device and restored during the program-
ming operation. Oscillator calibration bits
are stored at the Reset vector as the
operand of a MOVLW instruction.
End Programming
Bulk Erase Program Memory
to complete Bulk Erase.
END PROGRAMMING (EXTERNALLY TIMED)
DIS
1
0
(see Table 6-1) is
2
1
T
3
1
SET
1
4
1
To perform a full device Bulk Erase of the program
memory, configuration fuses, user IDs and backup
OSCCAL, the following sequence must be performed
(see Figure 3-13).
1.
2.
3.
4.
5.
6.
7.
T
HLD
Read and save 0x3FF oscillator calibration bits
and 0x404 backup OSCCAL bits into computer/
programmer temporary memory.
Enter Program/Verify mode.
Increment PC to 0x400 (first user ID location).
Perform a Bulk Erase command.
Wait T
Restore OSCCAL bits.
Restore backup OSCCAL bits.
5
x
1
ERA
6
x
to complete Bulk Erase.
T
DIS
© 2007 Microchip Technology Inc.
1
Next Command
2