PIC16C712-04/SO Microchip Technology, PIC16C712-04/SO Datasheet - Page 8

• Manufacturer Part Number: PIC16C712-04/SO
• Description: IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,SOP,18PIN,PLASTIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C712-04/SO

• Rohs Compliant: YES
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 13
• Program Memory Size: 1.75KB (1K x 14)
• Program Memory Type: OTP
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 18-SOIC (7.5mm Width)
• Processor Series: PIC16C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 13
• Number Of Timers: 3 bit
• Operating Supply Voltage: 2.5 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000
• Minimum Operating Temperature: 0 C
• On-chip Adc: 4 bit
• Data Rom Size: 128 B
• Height: 2.31 mm
• Length: 11.53 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4 V
• Width: 7.49 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

PIC16C712/716
5.
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS80072D-page 8
Module: Packaging
The package information contained in the data
sheet is incorrect. Please refer to the following
tables for correct package data.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
n
β
E1
E
eB
Dimension Limits
2
1
§
D
c
Units
eB
A2
A1
E1
B1
E
D
B
n
p
A
L
c
α
β
MIN
A1
A
.140
.115
.015
.300
.240
.890
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.898
.130
.012
.058
.018
.370
18
10
10
B
B1
MAX
.170
.145
.325
.260
.905
.135
.015
.070
.430
.022
15
15
MIN
22.61
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
 2003 Microchip Technology Inc.
NOM
p
22.80
2.54
3.94
3.30
7.94
6.35
3.30
0.29
1.46
0.46
9.40
α
18
10
10
MAX
A2
L
22.99
10.92
4.32
3.68
8.26
6.60
3.43
0.38
1.78
0.56
15
15