PIC16F631-E/SS Microchip Technology, PIC16F631-E/SS Datasheet - Page 13

IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,SSOP,20PIN,PLASTIC

PIC16F631-E/SS

Manufacturer Part Number
PIC16F631-E/SS
Description
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,SSOP,20PIN,PLASTIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F631-E/SS

Rohs Compliant
YES
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
18
Program Memory Size
1.75KB (1K x 14)
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
20-SSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
658-1047-5 - BOARD EVALUATION ACCESSTOUCHXLT20SS1-1 - SOCKET TRANSITION 20DIP 20SSOPAC162061 - HEADER INTRFC MPLAB ICD2 20PIN
Data Converters
-
Connectivity
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
APPENDIX A:
Rev A Document (7/2005)
Original release of this document.
Clarifications/Corrections to the Data Sheet:
Added Modules 1 through 7:
Module 1: Device V
Module 2: 4x4 QFN Package Marking
Module 3: Table 1-1: Pinout Description – PIC16F685
Module 4: Register 10-5: EECON1
Module 5: Table11-2: Registers Associated with
Module 6: Section 12.0 EUSART
Module 7: Section 14.2.2 MCLR
Rev B Document (8/2005)
Silicon Section:
Added Module 1: EUSART (PIC16F687/689/690 only).
Clarifications/Corrections to the Data Sheet:
Added Modules 8 and 9:
Module 8: SSP Module Overview
Module 9: Electrical Specifications.
Rev C Document (11/2005)
Silicon Section:
Added Module 2: SSP (PIC16F687/689/690 only)
Rev D Document (01/2006)
Clarifications/Corrections to the Data Sheet:
Replaced the 20-Lead QFN package diagram in
Module 2: 4x4 QFN Package Marking.
Rev E Document (7/2006)
Data
Removed Items 1 through 9, which have been
incorporated into the data sheet. Added Item 1, 20-pin
QFN Pin Diagram Title change.
Rev F Document (11/2006)
Data Sheet Clarifications/Corrections Section: Added
Item 2, Product Identification System, Examples
change.
Added Module 3: ECCP with Auto-Shutdown (Silicon
Rev. B2). Updated Module1: EUSART (PIC16F687/
689/690 only) and Module2: SSP (PIC16F687/689/690
only) with Fix information.
Rev G Document (01/2007)
Removed Rev. A6 reference from Module 2 (SSP).
Data Sheet Clarifications/Corrections Section: Added
Module 3, Comparator and Voltage Reference Modules
Associated Registers, removed REFCON register
reference. Added Module 4: DC Characteristics, Table
17.3, revised Max values.
Rev H Document (07/2007)
Added Module 4: Analog-to-Digital Converter (ADC)
Module. Module 2: Added Fix.
 2010 Microchip Technology Inc.
Sheet
Capture, Compare and Timer1
Clarifications/Corrections
DD
DOCUMENT
REVISION HISTORY
Range
PIC16F631/677/685/687/689/690
Section:
Rev J Document (09/2008)
Added Module 2.2: Under certain conditions, the
SSPIF flag sets on reception of the first byte (under
new 2. SSP (PIC16F687/689/690 only)), while
changing Module 2. to 2.1. Revised Module 5: LP/
Timer1 Oscillator Operations Below 25°C. Added
Module 6: SSP.
Clarifications/Corrections to the Data Sheet:
Removed Modules 1 through 4, which have been
included in the latest data sheet revision.
Rev K Document (04/2009)
Updated Errata to new format.
Deleted Module 6: SSP (PIC16F687/689/690).
Added Module 5: Timer1; Added Module 6: Timer0 and
WDT Prescaler Assignment Spurious Reset.
Rev L Document (07/2009)
Data Sheet Clarifications: Added Module 1: Peripheral
Features (Table 1: PIC16F631 Pin Summary).
Rev M Document (05/2010)
Added Module 5.3.
DS80243M-page 13

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