PIC16F737-E/SP Microchip Technology, PIC16F737-E/SP Datasheet - Page 42
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC16F737-E/SP
Manufacturer Part Number
PIC16F737-E/SP
Description
IC,MICROCONTROLLER,8-BIT,PIC CPU,CMOS,DIP,28PIN,PLASTIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F737-ISP.pdf
(276 pages)
4.PIC16F737-ISP.pdf
(10 pages)
Specifications of PIC16F737-E/SP
Rohs Compliant
YES
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
25
Program Memory Size
7KB (4K x 14)
Program Memory Type
FLASH
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3DBF777 - BOARD DAUGHTER ICEPIC3
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F737-ISP PDF datasheet #3
- PIC16F737-ISP PDF datasheet #4
- Current page: 42 of 688
- Download datasheet (3Mb)
PICmicro MID-RANGE MCU FAMILY
2.4
2.4.1
DS31002A-page 2-12
RC Start-up
External RC Oscillator
For timing insensitive applications the “EXTRC” device option offers additional cost savings. The
RC oscillator frequency is a function of; the supply voltage, the resistor (R
(C
from unit to unit due to normal process parameter variation. Furthermore, the difference in lead
frame capacitance between package types will also affect the oscillation frequency, especially for
low C
R
PIC16CXXX. For R
completely. For very high R
humidity and leakage. Thus, we recommend keeping R
Figure 2-6: EXTRC Oscillator Mode
Although the oscillator will operate with no external capacitor (C
using values above 20 pF for noise and stability reasons. With no or small external capacitance,
the oscillation frequency can vary dramatically due to changes in external capacitances, such as
PCB trace capacitance and package lead frame capacitance.
See characterization data for RC frequency variation from part to part due to normal process
variation. The variation is larger for larger resistance (since leakage current variation will affect
RC frequency more for large R) and for smaller capacitance (since variation of input capacitance
will affect RC frequency more).
See characterization data for variation of oscillator frequency due to V
values as well as frequency variation due to operating temperature for given R
V
The oscillator frequency, divided by 4, is available on the OSC2/CLKOUT pin, and can be used
for test purposes or to synchronize other logic (see
the
As the device voltage increases, the RC will start its oscillations immediately after the pin voltage
levels meet the input threshold specifications
Specifications”
tors. These include:
• Resistor value used
• Capacitor value used
• Device V
• System temperature
DD
EXT
EXT
Note 1: This output may also be able to be configured as a general purpose I/O pin.
“Architecture”
values.
EXT
) values, and the operating temperature. In addition to this, the oscillator frequency will vary
and C
values. The user also needs to take into account variation due to tolerance of external
DD
EXT
rise time
components used.
section). The time required for the RC to start oscillating depends on many fac-
EXT
section, for waveform).
C
R
V
values below 2.2 k , oscillator operation may become unstable, or stop
EXT
SS
EXT
V
EXT
DD
values (e.g. 1 M ), the oscillator becomes sensitive to noise,
Fosc/4
Figure 2-6
(1)
OSC1
OSC2/CLKOUT
shows how the RC combination is connected to a
(parameters D032
Figure 4-3: "Clock/Instruction Cycle"
EXT
Fosc
between 3 k and 100 k .
PIC16CXXX
Internal
clock
EXT
and
1997 Microchip Technology Inc.
= 0 pF), we recommend
D042
DD
for given R
EXT
in the
) and capacitor
EXT
, C
“Electrical
EXT
EXT
/C
, and
EXT
in
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