S29AL016D90TFI020 Spansion Inc., S29AL016D90TFI020 Datasheet - Page 56

Flash Memory IC

S29AL016D90TFI020

Manufacturer Part Number
S29AL016D90TFI020
Description
Flash Memory IC
Manufacturer
Spansion Inc.
Datasheet

Specifications of S29AL016D90TFI020

Memory Size
16Mbit
Ic Interface Type
Parallel
Access Time
90ns
Memory Case Style
TSOP
No. Of Pins
48
Operating Temperature Range
-40°C To +85°C
Peak Reflow Compatible (260 C)
Yes
Termination Type
SMD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Part Number:
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Physical Dimensions
VBK048—48-Ball Fine-Pitch Ball Grid Array (FBGA)
8.15 mm x 6.15 mm
56
CORNER
PACKAGE
JEDEC
SYMBOL
A
SD / SE
PIN A1
MD
ME
A1
A2
D1
E1
φb
A
D
E
N
e
A1
0.18
0.62
0.35
MIN
8.15 mm x 6.15 mm NOM
---
INDEX MARK
10
PACKAGE
8.15 BSC.
6.15 BSC.
5.60 BSC.
4.00 BSC.
0.80 BSC.
0.40 BSC.
VBK 048
NOM
N/A
---
---
---
48
---
---
8
6
SEATING PLANE
TOP VIEW
SIDE VIEW
MAX
1.00
0.76
0.43
---
D
OVERALL THICKNESS
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTE
A
0.10
A2
S29AL016D
P r e l i m i n a r y
C
(4X)
E
B
e
0.08
0.10
NOTES:
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
4.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6
7
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
C
C
6
AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
BALLS.
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
φb
φ 0.08
φ 0.15
H
M
M
C
C
G
A
BOTTOM VIEW
B
F
E
D1
D
SD
C
7
B
S29AL016D_00_A2 December 17, 2004
A
6
5
4
3
2
1
3338 \ 16-038.25b
A1 CORNER
SE
7
E1

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