G6Z-1FE-DC12 Omron, G6Z-1FE-DC12 Datasheet - Page 15

• Manufacturer Part Number: G6Z-1FE-DC12
• Description: HIGH FREQUENCY RELAY 2.6GHZ, 12VDC, SPDT
• Manufacturer: Omron
• Series: G6Zr

Specifications of G6Z-1FE-DC12

• Coil Frequency Max: 2.6GHz
• Coil Voltage Vdc Nom: 12V
• Contact Current Max: 500mA
• Contact Voltage Ac Nom: 30V
• Contact Voltage Dc Nom: 30V
• Coil Resistance: 720.4ohm
• Contact Configuration: SPDT
• Contact Form: 1 Form C
• Coil Voltage: 12 VDC
• Coil Current: 16.7 mA
• Coil Type: Non-Latching
• Power Consumption: 200 mW
• Termination Style: Solder Terminal
• Isolation: 60 dB to 65 dB at 900 MHz / 30 dB to 45 dB at 2.6 GHz
• Insertion Loss: 0.1 dB to 0.2 dB at 900 MHz / 0.3 dB to 0.5 dB at 2.6 GHz
• Maximum Switching Current: 0.5 A
• Contact Rating: 30 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

G6Z
Precautions
Refer to page 25 for information on general precautions. Be sure to read these precautions before using the Relay.
I
Please observe the following precautions to prevent failure to
operate, malfunction, or undesirable effect on product perfor-
mance.
High-frequency Characteristics Measurement
Method and Measurement Substrate
High-frequency characteristics for the G6Z are measured in the
way shown below. Consult your OMRON representative for
details on 50- Ω models.
Measurement Method for 75- Ω Models
Through-hole Substrate (75- Ω Models, E-shape or Y-shape)
SMD-type Substrate (75- Ω Models, E-shape or Y-shape)
132
40
40
(Unit: mm)
(Unit: mm)
Network vector analyzer
(Agilent Technologies)
Precautions for Correct Use
30
30
HP8753D
6.3
6.3
50-Ω/75-Ω adapter
(Agilent Technologies)
11852B-004
0.4
1.4
40
30
40
30
0.4
1.4
G6Z
4-dia. through-hole
0.6-dia. through-hole
4-dia. through-hole
0.6-dia. through-hole
3.59
3.91
1
1
75-Ω terminating
resistance
0.95
0.95
Substrate for High-frequency Characteristic Compensation
(75- Ω Models, E-shape or Y-shape)
Substrate Types
Material: FR-4 glass epoxy (glass cloth impregnated with epoxy
Thickness: 1.6 mm
Thickness of copper plating:18 µ m
Note:
Handling
Do not use the Relay if it has been dropped. Dropping the Relay
may adversely affect its functionality.
Protect the Relay from direct sunlight and keep the Relay under
normal temperature, humidity, and pressure.
Flow Soldering
Soldering temperature: Approx. 250 ° C (260 ° C if the DWS method
is used)
Soldering time: Approx. 5 s max. (approx. 2 s for the first time and
approx. 3 s for the second time if the DWS method is used)
Be sure to adjust the level of the molten solder so that the solder
will not overflow onto the PCB.
40
(Unit: mm)
30
0.95
1. The compensation substrate is used when measuring
2. For convenience, the diagrams of the high-frequency
3. Be sure to mount a standoff tightly to the through-hole
4. Use measuring devices, connectors, and substrates
5. Ensure that there is no pattern under the Relay. Other-
resin and copper laminated to its outer surface)
the Relay’s insertion loss. The insertion loss is ob-
tained by subtracting the measured value for the com-
pensation substrate from the measured value with the
Relay mounted to the high-frequency measurement
substrate.
measurement substrates given here apply both to
models with an E-shape terminal structure and to mod-
els with a Y-shape terminal structure.
substrate.
that are appropriate for 50 Ω and 75 Ω respectively.
wise, the impedance may be adversely affected and
the Relay may not be able to attain its full characteris-
tics.
1
30.7
20
4-dia. through-hole
0.6-dia. through-hole
G6Z