TEMT6200FX01 Vishay, TEMT6200FX01 Datasheet - Page 4

• Manufacturer Part Number: TEMT6200FX01
• Description: AMBIENT LIGHT SENSOR 0805 SMD
• Manufacturer: Vishay
• Type: Chipr

Specifications of TEMT6200FX01

• Wavelength: 550nm
• Output Type: Current
• Package / Case: 0805 (2012 Metric) - 2.20mm L x 1.25mm W x 0.85mm H
• Maximum Power Dissipation: 100 mW
• Maximum Dark Current: 50 nA
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Product: Ambient Light Sensor
• Transistor Polarity: NPN
• Wavelength Typ: 550nm
• Power Consumption: 100mW
• Viewing Angle: 60°
• No. Of Pins: 2
• Msl: MSL 3 - 168 Hours
• Half Sensitivity Angle ±: 60°
• Transistor Case Style: 0805
• Half Angle: 60°
• Operating Temperature Range: -40°C To +100°C
• Rohs Compliant: Yes
• Base Number: 6200
• Dark Current: 3nA
• Svhc: No SVHC (20-Jun-2011)
• Phototransistor Type: Phototransistor
• Polarity: NPN
• Number Of Elements: 1
• Emitter-collector Voltage (max): 1.5V
• Collector-emitter Voltage: 6V
• Collector Current (dc) (max): 20mA
• Dark Current (max): 50nA
• Power Dissipation: 100mW
• Half-intensity Angle: 120deg
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 2
• Package Type: SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 751-1056-2

REFLOW SOLDER PROFILE
Document Number: 81317
Rev. 1.6, 26-Mar-09
Fig. 9 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020D
Fig. 8 - Relative Radiant Sensitivity vs. Angular Displacement
94 8318
19841
1.0
0.9
0.8
0.7
300
250
200
150
100
50
0.6
0
0
255 °C
240 °C
217 °C
max. ramp up 3 °C/s max. ramp down 6 °C/s
0.4
50
0.2
max. 120 s
100
Time (s)
0°
0
150
For technical questions, contact:
10°
max. 100 s
max. 30 s
200
20°
max. 260 °C
Ambient Light Sensor in 0805
250
245 °C
30°
40°
50°
60°
70°
80°
300
Package
[e-mail]
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Time between soldering and removing from MBB must not
exceed the time indicated in J-STD-020:
Moisture sensitivity: level 3
Floor life: 168 h
Conditions: T
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
amb
< 30 °C, RH < 60 %
Vishay Semiconductors
TEMT6200FX01
www.vishay.com
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