TEMT6000X01 Vishay, TEMT6000X01 Datasheet - Page 4

• Manufacturer Part Number: TEMT6000X01
• Description: AMBIENT LIGHT SENSOR 1206 SMD
• Manufacturer: Vishay
• Type: Ambient Light Photo Sensor with Phototransistor Outputr

Specifications of TEMT6000X01

• Wavelength: 570nm
• Output Type: Current
• Package / Case: 4.00mm L x 2.00mm W x 1.05mm H
• Maximum Power Dissipation: 100 mW
• Maximum Dark Current: 50 nA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Product: Ambient Light Sensor
• Transistor Polarity: NPN
• Wavelength Typ: 570nm
• Power Consumption: 100mW
• Viewing Angle: 60°
• No. Of Pins: 3
• Msl: MSL 4 - 72 Hours
• Power Dissipation Pd: 100mW
• Light Current: 10µA
• Transistor Case Style: 1206
• Half Angle: 60°
• Operating Temperature Range: -40°C To +100°C
• Rohs Compliant: Yes
• Base Number: 6000
• Dark Current: 3nA
• Svhc: No SVHC (20-Jun-2011)
• Phototransistor Type: Phototransistor
• Polarity: NPN
• Number Of Elements: 1
• Lens Type: Transparent
• Emitter-collector Voltage (max): 1.5V
• Collector-emitter Voltage: 6V
• Collector Current (dc) (max): 20mA
• Collector-emitter Sat Volt (max): 100(Typ)V
• Dark Current (max): 50nA
• Power Dissipation: 100mW
• Peak Wavelength: 570nm
• Half-intensity Angle: 120deg
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 3
• Package Type: SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 751-1055-2

TEMT6000X01
Vishay Semiconductors
REFLOW SOLDER PROFILE
PACKAGE DIMENSIONS in millimeters
www.vishay.com
492
Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020D
19841
300
250
200
150
100
50
0
18464
0
255 °C
240 °C
217 °C
max. ramp up 3 °C/s max. ramp down 6 °C/s
50
max. 120 s
100
Time (s)
150
For technical questions, contact:
max. 100 s
max. 30 s
200
max. 260 °C
250
245 °C
300
Ambient Light Sensor
[e-mail]
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Time between soldering and removing from MBB must not
exceed the time indicated in J-STD-020:
Moisture sensitivity: level 3
Floor life: 168 h
Conditions: T
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions:
192 h at 40 °C (+ 5 °C), RH < 5 %
or
96 h at 60 °C (+ 5 °C), RH < 5 %.
amb
< 30 °C, RH < 60 %
Document Number: 81579
Rev. 1.8, 26-Mar-09