TC6502P065VCTTR Microchip Technology, TC6502P065VCTTR Datasheet - Page 6

IC TEMP SWTCH PUSH/PULL SOT23A-5

TC6502P065VCTTR

Manufacturer Part Number
TC6502P065VCTTR
Description
IC TEMP SWTCH PUSH/PULL SOT23A-5
Manufacturer
Microchip Technology
Datasheet

Specifications of TC6502P065VCTTR

Sensing Temperature
65°C Trip Point
Output Type
Active High/Push-Pull
Voltage - Supply
2.7 V ~ 5.5 V
Accuracy
±0.5°C
Package / Case
SC-74A, SOT-753
Ic Output Type
Logic
Sensing Accuracy Range
± 4°C
Supply Current
17µA
Supply Voltage Range
2.7V To 5.5V
Sensor Case Style
SOT-23
No. Of Pins
5
Termination Type
SMD
Temperature Threshold
+ 65 C
Full Temp Accuracy
6 C
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.7 V
Description/function
Ultra Small Temperature Switch with Pin Selectable Hysteresis
Maximum Operating Temperature
+ 135 C
Minimum Operating Temperature
- 55 C
Filter Terminals
SMD
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
TC6502P065VCTR
TC6502P065VCTTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TC6502P065VCTTR
Manufacturer:
MICROCHIP
Quantity:
12 000
TC6501/2/3/4
4.0
The TC6501/2/3/4 integrate a temperature sensor with
a factory-programmed threshold switch (see Functional
Block Diagrams in Figure 5-4 through Figure 5-7). A
logic signal is asserted when the die temperature
crosses the factory-programmed threshold. An external
hysteresis input pin allows the user to select either 2°C
or 10°C hysteresis to give further flexibility to the design
of the application. The TC6501 and TC6502 are
intended for a temperature range of 35°C to 125°C in
10°C increments. The TC6501 has an open-drain
output, while the TC6502 has a push-pull output stage.
The TC6503 and TC6504 are intended for a cold
temperature range of -45°C to +15°C in 10°C
increments. The TC6503 has an open-drain output,
while the TC6504 has a push/pull output stage. The
TC6501 and TC6503 are intended for applications with
a microcontroller reset input. The TC6502 and TC6504
are intended for applications where a fan or heater
element is turned on.
Please contact Microchip Technology for the availabil-
ity of a particular temperature threshold not included in
Table 4-1.
4.1
To prevent the output from “chattering” at or near the
trip point temperature, a selectable HYST input pin is
provided. Hysteresis can be externally selected at 2°C
(HYST = GND) or 10°C (HYST = V
CMOS compatible HYST input pin. Do not let the HYST
pin float, as this could cause an increase in supply
current. The hysteresis does not depend on the part’s
programmed trip threshold.
TABLE 4-1:
DS21451D-page 6
TC6501
TC6502
TC6503
TC6504
Part Number
DETAILED DESCRIPTION
Hysteresis Input
FACTORY-PROGRAMMED
THRESHOLD RANGE
+35°C < T
+35°C < T
-45°C < T
-45°C < T
Threshold (T
TH
TH
TH
TH
< +15°C
< +15°C
< +125°C
< +125°C
CC
) by means of the
TH
) Range
4.2
With a 17 µA typical supply current, the TC6501/2/3/4
dissipates very little power. Thus, the die temperature
is basically the same as the package temperature. To
minimize the error in temperature readings, the load
current should be limited to a few milliamps. For
example, the typical thermal resistance of a 5-Pin SOT-
23A package is 140°C/W. If, for instance, the TC6501
had to sink 1 mA, and the output voltage is ensured to
be less than 0.3V, an additional 0.3 mW of power is
dissipated within the temperature sensor. This
corresponds to a 0.042°C rise in die temperature.
Temperature-monitoring accuracy depends on the
thermal
monitored and the temperature switch die. Heat flows
primarily through the leads onto the die. Pin 2 provides
the lowest thermal resistance to the die. To achieve the
best temperature-monitoring results, the TC6501/2/3/4
should be placed closest to the device being
monitored. Additionally, a short and wide copper trace
from pin 2 to the device should be used. In some cases,
the 5-Pin SOT-23A package can be placed directly
under the socketed microcontroller for improved ther-
mal contact.
Thermal Considerations
resistance
between
2004 Microchip Technology Inc.
the
device
being

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