B57221V2103J60 EPCOS Inc, B57221V2103J60 Datasheet - Page 13

• Manufacturer Part Number: B57221V2103J60
• Description: THERMISTOR NTC 10K OHM 5% 0402
• Manufacturer: EPCOS Inc
• Series: B572**r
• Type: NTCr

Specifications of B57221V2103J60

• Package / Case: 0402 (1005 Metric)
• Resistance In Ohms @ 25°c: 10K
• Resistance Tolerance: ±5%
• B Value Tolerance: ±3%
• B25/50: 3940K
• B25/85: 3980K
• B25/100: 4000K
• Operating Temperature: -55°C ~ 125°C
• Power - Max: 150mW
• Mounting Type: Surface Mount
• Resistance: 10 KOhms
• Tolerance: 5 %
• Termination Style: SMD/SMT
• Operating Temperature Range: - 55 C to + 125 C
• Dimensions: 0.5 mm W x 1 mm L x 0.6 mm H
• Power Rating: 150 mW
• Thermistor Type: NTC
• Thermistor Tolerance: ± 5%
• Beta Value (k): 4000
• Thermistor Case Style: 0402
• No. Of Pins: 2
• Rohs Compliant: Yes
• Description Of Terminals: Leadless
• Mounting Style: Surface Mount
• Pin Count: 2
• Resistance @ 25c: 10kohm
• Percentage Of Resistance Tolerance @ 25c: ±5
• Product Length (mm): 1mm
• Product Height (mm): 0.5mm
• Product Depth (mm): 0.5mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• B0/50: -
• B25/75: -
• Lead Length: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 495-2086-2; B57221V2103J 60; B57221V2103J060

6
a) Component placement
b) Cracks
c) Component orientation
Please read Cautions and warnings and
Important notes at the end of this document.
Temperature measurement and compensation
SMD NTC thermistors, case size 0402 (1005)
Placement and orientation of SMD NTC thermistors on PCB
Page 13 of 18
It is recommended that the PC board
should be held by means of some
adequate supporting pins such as
shown left to prevent the SMDs from
being damaged or cracked.
When placing a component near an
area which is apt to bend or a grid
groove on the PC board, it is advisable
to have both electrodes subjected to
uniform stress, or to position the
component's electrodes at right angles
to the grid groove or bending line (see
c) Component orientation).
Choose a mounting position that
minimizes the stress imposed on the
chip during flexing or bending of the
board.
B572**V2